Abstract: A regenerator is provided, which may a hollow pipe body, a first mesh portion, a second mesh portion and a third mesh portion. The first mesh portion may be disposed inside the hollow pipe body and at the rear portion of the hollow pipe body. The second mesh portion may be disposed inside the hollow pipe body and at the central portion of the hollow pipe body, and connected to the first mesh portion. The third mesh section may be disposed inside the hollow pipe body and at the front portion of the hollow pipe body, and connected to the second mesh portion. The mesh number of the first mesh portion, the mesh number of the second mesh portion and the mesh number of the third mesh portion may be increased from the rear portion to the front portion of the hollow pipe body.

Abstract: A sealing structure for a Stirling cooler includes a bellows, a first connecting block disposed at an end of the bellows, and a second connecting block disposed at another end of the bellows. The sealing structure for a Stirling cooler can generate both off-axis movements and lateral movements so as to produce corresponding harmonic motions, such that vibrations can be isolated, excellent vacuum can be obtained, and superior sealing quality can be ensured. Thereupon, possible leakage for the Stirling cooler operated under a significant pressure difference can be substantially resolved.

Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Abstract: A thermal spreader comprises: a casing having a first side contacted with a heat source and a second side secured with a heat sink, and having a vapor chamber defined in an interior in the casing; and a crosslinking capillary lattice retained in the casing and occupying the vapor chamber in the casing, whereby upon evacuation to form vacuum in the vapor chamber and filling of a vaporizable working fluid in the vapor chamber, the working fluid will be repeatedly vaporized and condensed through the crosslinking capillary lattice to absorb and remove heat from the first side of the casing and to dissipate heat outwardly from the second side of the casing.

Abstract: A loop heat pipe with flat evaporator includes an evaporation section, a condensation section, and a transportation section connected between the evaporation section and the condensation section. The evaporation section includes a heat source, an enclosed containment structure, and a capillary structure.

Abstract: A LED lamp includes: a plurality of substrates juxtapositionally formed as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs when lit up, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat produced from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

Abstract: A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section.

Abstract: A thermal spreader comprises: a casing having a first side contacted with a heat source and a second side secured with a heat sink, and having a vapor chamber defined in an interior in the casing; and a crosslinking capillary lattice retained in the casing and occupying the vapor chamber in the casing, whereby upon evacuation to form vacuum in the vapor chamber and filling of a vaporizable working fluid in the vapor chamber, the working fluid will be repeatedly vaporized and condensed through the crosslinking capillary lattice to absorb and remove heat from the first side of the casing and to dissipate heat outwardly from the second side of the casing.

Abstract: A LED lamp includes: a plurality of substrates juxtapositionally formed as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs when lit up, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat produced from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

Abstract: A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section.

Abstract: A loop heat pipe with flat evaporator includes an evaporation section, a condensation section, and a transportation section connected between the evaporation section and the condensation section. The evaporation section includes a heat source, an enclosed containment structure, and a capillary structure.

Abstract: A microfabrication process comprises the swelling of at least a hydrophilic polymer in order for shrinking each cavity size of a micromachined microstructure pattern from three-dimensional orientations, whereby upon filling or deposition of metal into each cavity of the pattern when performing an electroforming step, a supermini microstructure with slim, fine, thin and small size can be obtained as geometrically miniaturized from three-dimensional orientations.