Patents by Inventor Shunichi FUJIMOTO

Shunichi FUJIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10414021
    Abstract: The present invention is objected to polish the surface of the object material with a high quality at a high polishing rate. The object surface is polished using a wet polishing method. Slurry is produced by scattering abrasive particles into pure water. In the abrasive particle, where components which has a mechanochemical effect and which reacts to the friction heat generated in polishing the object material are joined with each other and integrated to a particle. There, respective component is joined with each other using a mechanical alloying process, while maintaining the inherent material properties. When the slurry is used in a lapping process of sapphire, silicon carbide, gallium nitride and the like, the polishing process can be substantially shortened and the processing cost is drastically reduced. Further, it secures a high quality of the polishing surface. The abrasive particle can be used repeatedly in the polishing process.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: September 17, 2019
    Assignee: ASAHI KASEI KOGYO CO., LTD.
    Inventors: Shunichi Fujimoto, Tetsuji Yamashita
  • Publication number: 20160325398
    Abstract: [Object] The present invention is objected to polish the surface of the object material with a high quality at a high polishing rate. [Solution] The object surface is polished using a wet polishing method. Slurry is produced by scattering abrasive particles into pure water. In the abrasive particle, where components which has a mechanochemical effect and which reacts to the friction heat generated in polishing the object material are joined with each other and integrated to a particle. There, respective component is joined with each other using a mechanical alloying process, while maintaining the inherent material properties. When the slurry is used in a lapping process of sapphire, silicon carbide, gallium nitride and the like, the polishing process can be substantially shortened and the processing cost is drastically reduced. Further, it secures a high quality of the polishing surface. The abrasive particle can be used repeatedly in the polishing process.
    Type: Application
    Filed: January 19, 2015
    Publication date: November 10, 2016
    Inventors: Shunichi FUJIMOTO, Tetsuji YAMASHITA