Abstract: A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

Abstract: There is provided a humidifier superior in terms of hygiene, simple in terms of maintenance, wherein humidity is easily adjusted, and energy consumption is low. The humidifier uses as a moisture permeable membrane, a moisture-permeable polyurethane obtained by using as raw materials, at least an isocyanate component, a diol as a chain extender, and polyethylene glycol as a polyol component, and reacting these raw materials.

Abstract: A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.

Abstract: Provided are a matrix resin composition for fiber reinforced plastic, which comprises a bifunctional or trifunctional liquid diisocyanate, a bifunctional polyol and a bifunctional chain extender containing an active hydrogen group, with a molar ratio of the functional groups of the diisocyanate, polyol and chain extender of 5.0 to 1.0:1.0:4.0 to 0, respectively; and a process for producing fiber reinforced plastic, which comprises impregnating a fibrous material with the resin composition and then curing. The present invention makes it possible to produce a molding containing fibers densely, having excellent strength and inflatability, in the production of an FRP molding by using a thermosetting resin having an extended pot life.

Abstract: Provided are a shape memory polymer composition, which comprises a bifunctional isocyanate and/or a trifunctional isocyanate, and a polyol having an average molecular weight of from 100 to 550, with a molar ratio in terms of functional groups of isocyanate:polyol=0.9 to 1.1:1.0; FRP having the shape memory polymer and a fibrous material; and a production process of the FRP comprising impregnating the fibrous material with, as a matrix resin, the shape memory polymer composition and curing. According to the present invention, the shape memory polymer composition has an extended pot life and FRP has excellent inflatability.

Abstract: Provided are a prepreg for FRP (fiber reinforced plastic) which comprises a matrix resin composition containing a bifunctional isocyanate and/or a trifunctional isocyanate, a polyol and a bifunctional chain extender having two active hydrogen groups at a molar ratio, as a functional group, of isocyanate:polyol:chain extender=5.0 to 1.0:1.0:4.0 to 0, or containing a bifunctional isocyanate and/or a trifunctional isocyanate and a polyol at a molar ratio, as a functional group, of liquid isocyanate:polyol=0.9 to 1.1:1.0; and a fibrous material; and a production process of the prepreg. According to the present invention, the prepreg for FRP has a sufficient pot life and permits convenient production of an FRP molding.

Abstract: A photosensitive resin composition which is excellent in both sensitivity and resolution, can be rapidly developed with an aqueous alkali solution alone, further has excellent adhesion to substrates, and can give through imidization a light-colored polyimide resin film; and a circuit board having an insulating layer obtained from the photosensitive resin composition. The photosensitive resin composition comprises a poly(amic acid) resin, a 1,4-dihydropyridine derivative and a polyethylene glycol, and may optionally further contain a polyhydric phenol compound. This photosensitive resin composition can be developed at a high rate with a developing solution consisting only of an aqueous alkali solution. As a result, a satisfactory negative-pattern film which is a light-colored film can be formed with high sensitivity, high resolution, and a reduced film loss while preventing film coloration.

Abstract: A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5-50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

Abstract: The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound.

Abstract: An object of the present invention is to completely cure a resin composition highly capable of screening energy radiation, such as a carbon fiber-reinforced composite material (CFRP), simply by exposing the resin composition to UV radiation in the presence of a specific photopolymerization initiator system (reaction catalyst system) comprising at least two components. To this end, the present invention provides a resin curing method wherein, when a resin composition is exposed to energy radiation typified by UV radiation, another kind of first energy than the energy from an energy radiation source is autogenously generated within the resin, and the same kind of second energy is successively generated by the autogenously generated energy, so that the resin composition is cured by means of the first and second energies, or both the first and second energies and the energy from the energy radiation source, whether or not the resin composition contains a substance capable of screening energy radiation.

Abstract: A method for manufacturing a flexible printed circuit in which a resin solution is applied onto a circuit substrate having a wiring pattern on its surface so as to form a resin cover layer, having the steps of: wetting the surface of the circuit substrate with a solvent which is capable of dissolving the resin; applying the resin solution onto the surface wetted with the solvent; and drying the resin solution to thereby form the resin cover layer. A flexible printed circuit obtained in the manufacturing method.

Abstract: The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment of silicon wafers, and said wafer holder is characterized in that: the wafer holder is composed of a wafer support plate and three or more wafer support members mounted on said wafer support plate, each of the wafer support members having a wafer support portion or more; at least one of said wafer support members is a tilting wafer support member which has a plurality of upward-convex wafer support portions on the upper surface and is tiltable with respect to said wafer support plate; and the wafer is supported by at least four wafer support portions.

Abstract: A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.

Abstract: The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound.

Abstract: A photosensitive resin composition which is excellent in both sensitivity and resolution, can be rapidly developed with an aqueous alkali solution alone, further has excellent adhesion to substrates, and can give through imidization a light-colored polyimide resin film; and a circuit board having an insulating layer obtained from the photosensitive resin composition. The photosensitive resin composition comprises a poly(amic acid) resin, a 1,4-dihydropyridine derivative and a polyethylene glycol, and may optionally further contain a polyhydric phenol compound. This photosensitive resin composition can be developed at a high rate with a developing solution consisting only of an aqueous alkali solution. As a result, a satisfactory negative-pattern film which is a light-colored film can be formed with high sensitivity, high resolution, and a reduced film loss while preventing film coloration.

Abstract: A vibration damped structure, which is excellent in vibration absorption and sound absorption effect, is provided by coating the surface of a structure to be damped with a mixture of molten photopolymerizable resin and a photopolymerization initiator and then subjecting the coated surface to irradiation, whereby a vibration damping coating is formed on said surface.

Abstract: A medical tube made of an organic polymer having a mechanical loss tangent of at least 0.5 at body temperature and a modulus of transverse elasticity of 1-1000 MPa at body temperature. The medical tube of the present invention can be easily inserted into the body, and gives less pain and less feeling of physical disorder during indwelling in the body or removal from the body.

Abstract: A grip member has a grip proper (1) made of a shape-memory resin in the shape of a bar, a connecting pin (4) disposed in one terminal part of the grip proper, a forked part (3) formed integrally in the other terminal side of the grip proper, and an annular part (2) formed integrally slightly toward one end of the grip proper (1) and adapted for enabling the forked part (3) to twine thereon. The grip member is enabled to cope easily with a delicate change in the gripping condition by heating the grip proper (1) and the vicinity thereof to a temperature surpassing the glass transition point of the shape-memory resin thereby endowing the shape-memory rubber with a rubbery state, causing the forked part (3) to twine itself around the annular part (2) in such a manner as to impart the shape of a loop to the grip proper.

Abstract: A negative photoresist composition is disclosed which is excellent in sensitivity and resolution, tenaciously adheres to substrates, and can be advantageously used in practical production processes. Two 1,4-dihydropyridine derivatives each having a specific structure are incorporated as photosensitizers into a polyamic acid to obtain the negative photoresist composition.

Abstract: A negative-working photoresist composition comprising 1,4-dihydropyridine derivative as a photosensitive material and a polyamic acid, a heat-resisting photoresist composition comprising a photosensitive polyamic acid which is excellent in sensitivity and resolution and can be easily developed with an aqueous alkali solution is provided. The negative-working photoresist composition contains a polyamic acid and a 1,4-dihydropyridine derivative represented by following formula (I): ##STR1## wherein Ar represents an aromatic group having a nitro group at the ortho-position; R.sup.1 represents an alkylene group having from 1 to 5 carbon atoms; and R.sup.2, R.sup.3, R.sup.4, and R.sup.5 each represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms.