Abstract: [Problem] An object of the present disclosure is to provide a new purging compound for a resin processing machine made from a resin derived from a biomass raw material which reduces the environmental load, and has a purging performance comparable to those of conventional purging compounds for a resin processing machine. [Solution] A purging compound for a resin processing machine contains 10 to 97% by mass of a resin having a bio degree of 30% or more with respect to 100% by mass of the purging compound, wherein the resin has a weight average molecular weight of 200,000 or more and 1,500,000 or less, and a ratio of the weight average molecular weight to the number average molecular weight (Mw/Mn) of 8 or less.

Abstract: Provided is a resin composition that is excellent in balance between tenacity and rigidity, suppresses variation in physical properties, and is further excellent in moldability. The disclosure provides a resin composition at least comprising 100 parts by mass of polyacetal resin (A), 0.01 to 1 part by mass of fatty acid metal salt (B), and 0.1 to 3 parts by mass of zinc oxide (C), wherein a total content of the polyacetal resin (A), the fatty acid metal salt (B), and the zinc oxide (C) is 98.0% by mass or more.

Abstract: To provide a polyamide resin composition which exhibits superior impact resistance and in which fluctuations in physical properties, that is, variation in impact resistance, tensile strength, and tensile elongation are suppressed. The polyamide resin includes: (A) 65 to 90 parts by mass of a polyamide resin; (B) 10 to 35 parts by mass of an impact modifier; (C) 0.1 to 0.5 parts by mass of carbon black with respect to 100 parts by mass of the total amount of Component (A) and Component (B); and (D) 1 to 100 parts by mass of an inorganic filler with respect to 100 parts by mass of the total amount of Component (A) and Component (B, wherein the average primary particle diameter of Component (C) is 20 nm or less.

Abstract: The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.

Abstract: The resin composition of the present invention comprises (a) a polypropylene-based resin, (b) a polyphenylene ether-based resin, and (c) a first hydrogenated block copolymer-based resin and further comprises (d) an ethylene-?-olefin copolymer rubber and/or (e) a second hydrogenated block copolymer-based resin.

Abstract: The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.

Abstract: The present invention provides a resin composition including: (a): 75 to 97% by mass of a polypropylene-based resin; (b): 1 to 15% by mass of a polyphenylene ether-based resin having a reduced viscosity (?sp/c: measured as a 0.5 g/dL chloroform solution at 30° C.) of 0.25 to 0.36 dL/g; and (c): 2 to 19% by mass of a hydrogenated block copolymer which is a hydrogenated product of a block copolymer including at least two polymer blocks A mainly including a vinyl aromatic compound and at least one polymer block B mainly including a conjugated diene compound, wherein the polymer block A has a number average molecular weight (MncA) of 4,000 to 8,000 excluding 8,000, and a mass ratio ((b)/(c)) of the component (b) to the component (c) is 10/90 to 60/40.

Abstract: The resin composition of the present invention comprises (a) a polypropylene-based resin, (b) a polyphenylene ether-based resin, and (c) a first hydrogenated block copolymer-based resin and further comprises (d) an ethylene-?-olefin copolymer rubber and/or (e) a second hydrogenated block copolymer-based resin.

Abstract: Provided is a flame-retardant thermoplastic resin composition including (A) a thermoplastic resin other than a polyphenylene ether, (B) polyphenylene ether, (C) at least one phosphinate selected from the group consisting of a phosphinate having a particular structure, a diphosphinate having a particular structure and a condensate thereof, and (D) at least one colorant selected from the group consisting of an organic pigment, an inorganic pigment and an organic dye, wherein a content of an iron element is less than 50 ppm on a mass basis.

Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Abstract: The polyphenylene ether according to the present invention includes 5 to 20% by mass of a component having a molecular weight of 50,000 or more and 12 to 30% by mass of a component having a molecular weight of 8,000 or less. The resin composition according to the present invention includes the polyphenylene ether (a) and a hydrogenated block copolymer (b) prepared by hydrogenating a block copolymer including at least two polymer blocks A having a vinyl aromatic compound and at least one polymer block B having a conjugated diene compound, wherein the number average molecular weight (Mnb) of the hydrogenated block copolymer is 100,000 or less, and the number average molecular weight (MnbA) of at least one polymer block of the polymer blocks A is 8,000 or more.

Abstract: The polyphenylene ether according to the present invention includes 5 to 20% by mass of a component having a molecular weight of 50,000 or more and 12 to 30% by mass of a component having a molecular weight of 8,000 or less. The resin composition according to the present invention includes the polyphenylene ether (a) and a hydrogenated block copolymer (b) prepared by hydrogenating a block copolymer including at least two polymer blocks A having a vinyl aromatic compound and at least one polymer block B having a conjugated diene compound, wherein the number average molecular weight (Mnb) of the hydrogenated block copolymer is 100,000 or less, and the number average molecular weight (MnbA) of at least one polymer block of the polymer blocks A is 8,000 or more.

Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Abstract: The polyphenylene ether according to the present invention includes 5 to 20% by mass of a component having a molecular weight of 50,000 or more and 12 to 30% by mass of a component having a molecular weight of 8,000 or less. The resin composition according to the present invention includes the polyphenylene ether (a) and a hydrogenated block copolymer (b) prepared by hydrogenating a block copolymer including at least two polymer blocks A having a vinyl aromatic compound and at least one polymer block B having a conjugated diene compound, wherein the number average molecular weight (Mnb) of the hydrogenated block copolymer is 100,000 or less, and the number average molecular weight (MnbA) of at least one polymer block of the polymer blocks A is 8,000 or more.

Abstract: Provided is a microporous film formed of a thermoplastic resin composition comprising 100 parts by mass of (a) a polyolefin resin and from 5 to 90 parts by mass of (b) a polyphenylene ether resin; the microporous film having a sea-island structure with the polyolefin resin as a sea portion and with the polyphenylene ether resin as an island portion and having a air permeability of from 10 sec/100 cc to 5000 sec/100 cc. The microporous film does not break easily even at high temperatures and has good heat resistance.

Abstract: Provided is a microporous film formed of a thermoplastic resin composition comprising 100 parts by mass of (a) a polyolefin resin and from 5 to 90 parts by mass of (b) a polyphenylene ether resin; the microporous film having a sea-island structure with the polyolefin resin as a sea portion and with the polyphenylene ether resin as an island portion and having a air permeability of from 10 sec/100 cc to 5000 sec/100 cc. The microporous film does not break easily even at high temperatures and has good heat resistance.