Patents by Inventor Shunji Kaneda

Shunji Kaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9321142
    Abstract: The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50° C. after saturation swelling with 50° C. water of 130 to 800 MPa, a loss tangent at 50° C. of not more than 0.2, and a contact angle with water of not more than 80°.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: April 26, 2016
    Assignee: KURARAY CO., LTD.
    Inventors: Chihiro Okamoto, Shinya Kato, Shunji Kaneda, Hirofumi Kikuchi
  • Publication number: 20090298392
    Abstract: The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50° C. after saturation swelling with 50° C. water of 130 to 800 MPa, a loss tangent at 50° C. of not more than 0.2, and a contact angle with water of not more than 80°.
    Type: Application
    Filed: September 21, 2006
    Publication date: December 3, 2009
    Applicant: Kuraray Co., Ltd
    Inventors: Chihiro Okamoto, Shinya Kato, Shunji Kaneda, Hirofumi Kikuchi
  • Patent number: 6979701
    Abstract: The present invention aims to provide a polyurethane foam, suitably usable as a polishing pad, having a uniform foam structure, which can achieve the improvements in the flatness of the surface of polished materials and in the planarization efficiency, and can extend the polishing pad life longer than that of the conventional polyurethane foams. This aim can be achieved by providing a polyurethane foam having a density of 0.5 to 1.0 g/cm3, a cell size of 5 to 200 ?m and a hardness [JIS-C hardness] of not less than 90, comprising a thermoplastic polyurethane which is obtained by a reaction of a high polymer polyol, an organic diisocyanate and a chain extender, contains not less than 6% by weight of a nitrogen atom derived from the isocyanate group, and has a storage elastic modulus measured at 50° C. [E?50] of not less than 5×109 dyn/cm2.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: December 27, 2005
    Assignee: Kuraray Co., Ltd.
    Inventors: Shunji Kaneda, Chihiro Okamoto
  • Publication number: 20040054023
    Abstract: The present invention aims to provide a polyurethane foam, suitably usable as a polishing pad, having a uniform foam structure, which can achieve the improvements in the flatness of the surface of polished materials and in the planarization efficiency, and can extend the polishing pad life longer than that of the conventional polyurethane foams. This aim can be achieved by providing a polyurethane foam having a density of 0.5 to 1.0 g/cm3, a cell size of 5 to 200 &mgr;m and a hardness [JIS-C hardness] of not less than 90, comprising a thermoplastic polyurethane which is obtained by a reaction of a high polymer polyol, an organic diisocyanate and a chain extender, contains not less than 6% by weight of a nitrogen atom derived from the isocyanate group, and has a storage elastic modulus measured at 50° C. [E′50] of not less than 5×109 dyn/cm2.
    Type: Application
    Filed: June 9, 2003
    Publication date: March 18, 2004
    Inventors: Shunji Kaneda, Chihiro Okamoto
  • Patent number: 4560715
    Abstract: Incorporation in a thermoplastic resin of a mass of mica flakes having a median shape factor of not less than 0.76, an average particle size of not more than 2,000 .mu.m and an average aspect ratio of not less than 10 followed by molding gives moldings which are high not only in mechanical strength but also in strength at weld parts. Incorporation of said mica flake mass in a thermosetting resin followed by molding affords moldings very high in strength as well as in modulus of elasticity.
    Type: Grant
    Filed: March 14, 1984
    Date of Patent: December 24, 1985
    Assignee: Kuraray Co., Ltd.
    Inventors: Ryuhei Ueeda, Kiyonobu Fujii, Akira Kubotsu, Shunji Kaneda, Kenji Okuno