Abstract: Provided is an orally administrable vaccine against a coronavirus infectious disease. A transformed Bifidobacterium designed to display a part or a whole of a constituent protein of a coronavirus on a surface of the Bifidobacterium enables the provision of the orally administrable vaccine against a coronavirus infectious disease. The transformed Bifidobacterium designed to display a part or a whole of a constituent protein of a coronavirus on a surface of the Bifidobacterium can induce humoral immunity and cellular immunity through oral administration to suppress an increase in severity of pneumonia or the like even after viral infection.

Abstract: An object is to reduce parasitic capacitance of a signal line included in a liquid crystal display device. A transistor including an oxide semiconductor layer is used as a transistor provided in each pixel. Note that the oxide semiconductor layer is an oxide semiconductor layer which is highly purified by thoroughly removing impurities (hydrogen, water, or the like) which become electron suppliers (donors). Thus, the amount of leakage current (off-state current) can be reduced when the transistor is off. Therefore, a voltage applied to a liquid crystal element can be held without providing a capacitor in each pixel. In addition, a capacitor wiring extending to a pixel portion of the liquid crystal display device can be eliminated. Therefore, parasitic capacitance in a region where the signal line and the capacitor wiring intersect with each other can be eliminated.

Abstract: According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on which a material to be adsorbed is to be mounted and a second major surface on a side opposite the first major surface. The electrode is interposed between the first major surface and the second major surface of the ceramic dielectric substrate. The conductive member is provided in a recess formed in the second major surface of the ceramic dielectric substrate. A tip end of the recess has a curved surface.

Abstract: An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler.

Abstract: According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on which a material to be adsorbed is to be mounted and a second major surface on a side opposite the first major surface. The electrode is interposed between the first major surface and the second major surface of the ceramic dielectric substrate. The conductive member is provided in a recess formed in the second major surface of the ceramic dielectric substrate. A tip end of the recess has a curved surface.

Abstract: The present invention relates to a method for using an electrostatic chuck which can achieve clamping force of 100 gf/cm2 within 60 seconds at low voltage of ±1 kV or less compared to high voltage of the conventional art such as 3 kV or 10 kV for electrostatically clamping a glass substrate. There is provided a method for clamping a glass substrate with an electrostatic chuck having a dielectric layer in which the upper surface of the dielectric layer of the electrostatic chuck has a surface roughness Ra of 0.8 ?m or less and the volume resistivity of the dielectric layer of the electrostatic chuck is 108-1012 ?cm, comprising the steps of increasing the temperature of the glass substrate so as to change the volume resistivity of the glass substrate to be 1014 ?cm or less, and clamping the glass substrate to the upper surface of the dielectric layer of the electrostatic chuck.