Patents by Inventor Shunsuke Aizawa

Shunsuke Aizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939746
    Abstract: A surroundings monitoring system for a work machine includes an image capturing unit configured to capture an image of surroundings of the work machine and a display device configured to display the image of the surroundings of the work machine captured by the image capturing unit and a mark representing the position of a monitoring target. The display device is configured to display the mark in two or more different display forms.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 26, 2024
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventors: Yoshihisa Kiyota, Shunsuke Otsuki, Susumu Aizawa
  • Patent number: 11373895
    Abstract: An etching method is performed using a plasma processing apparatus that includes a processing chamber equipped with a support stage that accommodates a substrate, a first annular member disposed around the substrate and at least a part of the first annular member is disposed in a space between a lower surface of an outer peripheral portion of the substrate and an upper surface of the support stage, and a second annular member disposed outside the first annular member. The etching method includes adjusting a dielectric constant in the space using the first annular member in accordance with consumption of the second annular member; and etching the substrate.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 28, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Fumiaki Ariyoshi, Masanori Asahara, Shunsuke Aizawa, Akihito Fushimi
  • Publication number: 20210005503
    Abstract: An etching method is performed using a plasma processing apparatus that includes a processing chamber equipped with a support stage that accommodates a substrate, a first annular member disposed around the substrate and at least a part of the first annular member is disposed in a space between a lower surface of an outer peripheral portion of the substrate and an upper surface of the support stage, and a second annular member disposed outside the first annular member. The etching method includes adjusting a dielectric constant in the space using the first annular member in accordance with consumption of the second annular member; and etching the substrate.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Fumiaki ARIYOSHI, Masanori ASAHARA, Shunsuke AIZAWA, Akihito FUSHIMI
  • Patent number: 9517913
    Abstract: In a sheet or signature (printer folder sheet) accumulating a front positioning part 44 configured, when a sheet has entered a sheet accumulating part 40, to move away from a rear positioning part 46 such that a distance of the front positioning part 44 from the rear positioning part 46 is larger than a length of the sheet in a carrying-in direction of the sheet, and, after a front edge in the carrying-in direction of the sheet has contacted the front positioning part 44, to move closer to the rear positioning part 46.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: December 13, 2016
    Assignee: Kabushiki Kaisha Tokyo Kikai Seisakusho
    Inventors: Shunsuke Aizawa, Kenichi Yamagiwa
  • Publication number: 20150307309
    Abstract: In a sheet or signature (printer folder sheet) accumulating a front positioning part 44 configured, when a sheet has entered a sheet accumulating part 40, to move away from a rear positioning part 46 such that a distance of the front positioning part 44 from the rear positioning part 46 is larger than a length of the sheet in a carrying-in direction of the sheet, and, after a front edge in the carrying-in direction of the sheet has contacted the front positioning part 44, to move closer to the rear positioning part 46.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 29, 2015
    Inventors: Shunsuke Aizawa, Kenichi Yamagiwa