Abstract: A composition having an egg white substitute function, the composition including a polysaccharide thickener, and a starch, in which the polysaccharide thickener is one kind or two or more kinds selected from the group consisting of methyl cellulose, mannan, and curdlan, and the starch is one or two kinds selected from the group consisting of a distarch phosphate and a pea starch.

Abstract: A semiconductor device includes semiconductor elements arranged in a first direction, an arm connection portion disposed between the semiconductor elements in the first direction, first and second power supply terminals disposed on the same side in the first direction, first and second substrates interposing the semiconductor elements therebetween, and a sealing body. The second substrate includes an insulating base member, a front-face metal body and a back-face metal body. The front-face metal body includes a second power supply wiring and a second relay wiring. The second power supply wiring includes a base portion on which the second element is arranged, and a pair of extending portions extending from the base portion in the first direction. The second relay wiring is disposed between the extending portions in a second direction, so that the second relay wiring and the base portion satisfy a relationship of L1<L2<L3.

Abstract: An imaging member including: a pressing member that presses a breast of a subject; and an ultrasonography member that has a first surface on which an acoustic matching member having fluidity is provided, and is provided such that a second surface on a side opposite to the first surface is provided on a surface of the pressing member, which is on a side opposite to a surface that comes into contact with the breast, via a coupling material having lower fluidity than the acoustic matching member.

Abstract: In a semiconductor module, two switching elements are connected in parallel to each other. Each of the switching elements includes a first main electrode formed on one surface side, and a second main electrode and a gate electrode formed on a rear surface side opposite to the one surface side. A first conductor plate is coupled with two first main terminals at first coupling portions and is electrically connected with the first main electrodes. A second conductor plate is coupled with one second main terminal at a second coupling portion and is electrically connected with the second main electrodes. The second coupling portion is disposed between the switching elements in an alignment direction of the switching elements, and the first coupling portions are provided on both sides of the second coupling portion in the alignment direction.

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

Abstract: In a semiconductor module, two switching elements are connected in parallel to each other. Each of the switching elements includes a first main electrode formed on one surface side, and a second main electrode and a gate electrode formed on a rear surface side opposite to the one surface side. A first conductor plate is coupled with two first main terminals at first coupling portions and is electrically connected with the first main electrodes. A second conductor plate is coupled with one second main terminal at a second coupling portion and is electrically connected with the second main electrodes. The second coupling portion is disposed between the switching elements in an alignment direction of the switching elements, and the first coupling portions are provided on both sides of the second coupling portion in the alignment direction.

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

Abstract: A vehicle body includes a pillar member disposed on an outer side of a cabin in a vehicle width direction and a side wall member located closer to inside in the vehicle width direction than the pillar member and coupled to the pillar member. The guide member for guiding drawing of a webbing includes a front edge fixing portion coupled to the pillar member, a rear edge fixing portion coupled to the side wall member, and a guide body whose two ends are coupled to the front and rear edge fixing portions and which forms a webbing drawing opening together with the pillar member and the side wall member. The front and rear edge fixing portions are separated from each other with an interval greater than or equal to a width of the webbing and coupled to the pillar member and the side wall member.

Abstract: A vehicle body includes a pillar member disposed on an outer side of a cabin in a vehicle width direction and a side wall member located closer to inside in the vehicle width direction than the pillar member and coupled to the pillar member. The guide member for guiding drawing of a webbing includes a front edge fixing portion coupled to the pillar member, a rear edge fixing portion coupled to the side wall member, and a guide body whose two ends are coupled to the front and rear edge fixing portions and which forms a webbing drawing opening together with the pillar member and the side wall member. The front and rear edge fixing portions are separated from each other with an interval greater than or equal to a width of the webbing and coupled to the pillar member and the side wall member.