Abstract: Even in a case of a waste plastic whose use history is unknown, blending of an additive for recycling into a recycled plastic having a desired physical property can be estimated with high accuracy. A plastic recycling supporting apparatus 100 that supports plastic recycling in which a plastic is blended with an additive and is recycled into a recycled plastic having a desired physical property includes: a physical property and deterioration estimator 140 configured to estimate, using a physical property and deterioration estimation model, a physical property and a deterioration degree of the plastic based on a texture structural feature extracted from surface analysis data of the plastic; and a blending estimator 150 configured to estimate a physical property of the recycled plastic based on the physical property and the deterioration degree of the plastic and a blending condition of the additive using a physical property recovery model.

Abstract: An inspecting apparatus for inspecting a substrate includes an objective lens attaching part equipped with a plurality of objective lenses each having a different working distance (WD), an objective lens exchanging device which exchanges the objective lens, and a loading stage which is opposed to the objective lens and on which the substrate S is loaded. An objective lens detecting device detects the WD of the objective lens. Displacing devices relatively displace the objective lens and the loading stage in the direction of the optical axis of an inspecting light path and a direction rectangular to the optical axis. And a displacement controlling device controls the relative displacement of the objective lens and the loading stage in the direction rectangular to the optical axis when the lens detecting device detects that the WD of the objective lens is shorter than a predetermined WD.

Abstract: A visual inspection apparatus includes an upper illuminator, a lower illuminator, a side illuminator, and a pair of inclined illuminators, which illuminate the peripheral edge of a wafer, and illuminates the peripheral edge of the wafer brightly. A gap is formed in the upper illuminator and illumination light of an epi-illumination portion is injected through the gap. The illumination light of the epi-illumination portion is refracted and reflected by a first mirror to illuminate the peripheral edge of the wafer. The illumination position is changed by moving second mirrors together as needed. An image of the peripheral edge is acquired in an imaging portion disposed at the same axis as the epi-illumination portion.

Abstract: It is an object of the present invention to provide a substrate processing apparatus, comprising a housing body mounting unit that is capable of mounting a plurality of housing bodies which can house a plurality of substrates, a processing apparatus main body for processing a substrate extracted from the housing body, a transportation unit for transporting the substrate between the housing body and the processing apparatus main body, a processing control unit for controlling the transportation unit and making it transport the substrate between the housing body and the processing apparatus main body, and a transportation control unit for controlling the transportation unit and making it transport the substrate from one housing body to another housing body without passing through the processing apparatus main body.

Abstract: An image inspection system includes a mount stage for a subject; an observation optical system for imaging light reflected by the subject; a focal position moving mechanism for relatively moving a position of the observation optical system in a depth direction of focus with respect to the subject; a mechanism for detecting a first target focal position by using light reflected by the subject; a focal position correcting device for determining a second target focal position offset from the first target focal position; a device for driving the focal position moving mechanism so as to focus on the second target focal position; and a section for storing condition setting data for each subject, which includes an offset value for determining the second target focal position. The focal position correcting device determines the second target focal position in accordance with the offset value in the condition setting data.

Abstract: A substrate inspection apparatus includes a recipe preparation unit that batch-allocates a plurality of slots containing substrates of each type with a corresponding one of a plurality of original recipes to the each type, the plurality of original recipes corresponding to different types of substrates respectively, so as to prepare an actual recipe based on the plurality of original recipes, and to inspect the different types of substrates according to the actual recipe.

Abstract: An AF apparatus for a microscope (1) of the present invention includes: an observational optical system (6) which radiates light on an object under inspection (3) via one of multiple interchangeable objective lens (2) and which has a CCD (imaging device) (5) for observing reflected light from the object under inspection (3); a light flooding portion (7) which radiates a laser (non-visible light) on the object under inspection (3) via the objective lens (2) of the observational optical system (6); a focal point detection optical system (10) which has a photo-detector (photo-electric conversion portion) (8) that is arranged at an image surface of a light figure of the reflected laser from the object under inspection and that outputs signals corresponding to the position of the light figure inside the image surface, and which detects the relative distance between the objective lens (2) and the object under inspection (3); an object position adjusting unit (11) which adjusts the focal position of the object under

Abstract: An image inspection system includes a mount stage for a subject; an observation optical system for imaging light reflected by the subject; a focal position moving mechanism for relatively moving a position of the observation optical system in a depth direction of focus with respect to the subject; a mechanism for detecting a first target focal position by using light reflected by the subject; a focal position correcting device for determining a second target focal position offset from the first target focal position; a device for driving the focal position moving mechanism so as to focus on the second target focal position; and a section for storing condition setting data for each subject, which includes an offset value for determining the second target focal position. The focal position correcting device determines the second target focal position in accordance with the offset value in the condition setting data.

Abstract: A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: An object image data obtained by image taking by an image taking device, while a distance between a stage, on which an object is placed, and the image taking device is varied, is captured by a focus processing device at each predetermined timing. The focus processing device retrieves contrast data indicating a maximum value from the captured respective object image data, and stores the object image data in the image information memory. The object image data of the contrast data indicating the maximum value is read from the image information memory, and outputted and displayed on a display section.

Abstract: A substrate inspection apparatus includes a recipe preparation unit that batch-allocates a plurality of slots containing substrates of each type with a corresponding one of a plurality of original recipes to the each type, the plurality of original recipes corresponding to different types of substrates respectively, so as to prepare an actual recipe based on the plurality of original recipes, and to inspect the different types of substrates according to the actual recipe.

Abstract: An object is held on a stage of an equipment, the stage is rotated in order to acquire a detection signal corresponding to a position of an outer peripheral edge of the object, a displacement of the object with respect to an alignment reference position is obtained based on this detection signal, and the stage is subjected to movement control so as to eliminate this displacement, thereby aligning the object.

Abstract: It is an object of the present invention to provide a substrate processing apparatus, comprising a housing body mounting unit that is capable of mounting a plurality of housing bodies which can house a plurality of substrates, a processing apparatus main body for processing a substrate extracted from the housing body, a transportation unit for transporting the substrate between the housing body and the processing apparatus main body, a processing control unit for controlling the transportation unit and making it transport the substrate between the housing body and the processing apparatus main body, and a transportation control unit for controlling the transportation unit and making it transport the substrate from one housing body to another housing body without passing through the processing apparatus main body.

Abstract: An inspecting apparatus is for inspecting a substrate by magnifying a surface of the substrate through an objective lens.

Abstract: A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: An imaging device is provided which includes an LED, a telecentric lens which collimates LED light and converts light reflected by an object, a half mirror which reflects the LED light toward the telecentric lens and allows transmission of the reflected light converged by the telecentric lens, a diaphragm, and a two-dimensional imaging element.

Abstract: An object image data obtained by image taking by an image taking device, while a distance between a stage, on which an object is placed, and the image taking device is varied, is captured by a focus processing device at each predetermined timing. The focus processing device retrieves contrast data indicating a maximum value from the captured respective object image data, and stores the object image data in the image information memory. The object image data of the contrast data indicating the maximum value is read from the image information memory, and outputted and displayed on a display section.

Abstract: An object is held on a stage of an equipment, the stage is rotated in order to acquire a detection signal corresponding to a position of an outer peripheral edge of the object, a displacement of the object with respect to an alignment reference position is obtained based on this detection signal, and the stage is subjected to movement control so as to eliminate this displacement, thereby aligning the object.

Abstract: A semiconductor wafer inspection apparatus of the present invention is provided with the following a rotatable table on which a semiconductor wafer is sucked and held, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: In an optical device having an objective lens for magnifying an image of a target object and a focusing unit including a laser source for irradiating the target object through the objective lens and a focus detecting light-receiving section for receiving light reflected from the target object, positions in the periphery of the target object are detected by using the laser beam emitted from the laser source of the focusing unit while changing a relative positional relationship between the target object and the objective lens.