Patents by Inventor Shunsuke Nagasaki

Shunsuke Nagasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux for solder paste
    Patent number: 6881278
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 ?m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: April 19, 2005
    Assignee: Showa Denko K.K.
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Flux for solder paste
    Publication number: 20030200836
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 &mgr;m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Application
    Filed: April 7, 2003
    Publication date: October 30, 2003
    Applicant: SHOWA DENKO K.K.
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
    Publication number: 20020046627
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 &mgr;m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Application
    Filed: September 14, 2001
    Publication date: April 25, 2002
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Golden yellow pigment
    Patent number: 5246493
    Abstract: A golden yellow pigment having good corrosion resistance and weather resistance is disclosed, which comprises titanium metal flakes the surfaces of which are covered with a titanium nitride layer, the titanium nitride-covered titanium metal flakes having a nitrogen content of from 5 to 22% by weight, an oxygen content of 2% by weight or less, and an aspect ratio of 10 or more.
    Type: Grant
    Filed: September 15, 1992
    Date of Patent: September 21, 1993
    Assignees: Showa Denko K.K., Showa Alumi Powder K.K.
    Inventors: Shunsuke Nagasaki, Kajin Saito, Takuya Tamou