Abstract: A blood flow measuring unit of a blood flow measurement apparatus of an embodiment includes an optical system for applying an OCT scan to an eye fundus and obtains blood flow information based on data acquired by the OCT scan. A movement mechanism moves the optical system. A controller applies a first movement control to the movement mechanism to move the optical system in a first direction orthogonal to an optical axis of the optical system by a predetermined distance from the optical axis. A judging unit judges occurrence of vignetting based on a detection result of return light of light incident on the eye through the optical system after the first movement control. The controller applies a second movement control to the movement mechanism to further move the optical system based on a judgement result obtained by the judging unit.

Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that an elongation rate of the first insulating layer is greater than an elongation rate of each insulating layer other than the first insulating layer in the build-up part, and the covering layer is formed such that the covering layer has an opening entirely exposing an upper surface and a side surface of the first conductor pad.

Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that a tensile strength of the first insulating layer is higher than a tensile strength of each insulating layer other than the first insulating layer in the first build-up part, and the covering layer is formed such that the covering layer has opening entirely exposing an upper surface and a side surface of the first conductor pad.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the opening is exposing 50% or more of an area of a surface of the conductor pad on the opposite side with respect to the insulating layer and exposing a side surface and the surface of the conductor pad at side portions of a peripheral edge of the conductor pad and that the solder resist layer is covering the side surface and the surface of the conductor pad at one or more of corner portions of the peripheral edge of the conductor pad.

Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.

Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first surface exposed on a first surface side of the insulating layer, and a conductor post formed on a second surface of the conductor layer on the opposite side with respect to the first surface such that the conductor post has a side surface covered by the insulating layer. The conductor post has an end surface on the opposite with respect to the conductor layer such that the end surface of the conductor post is exposed on a second surface side of the insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the conductor layer.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first surface exposed on a first surface side of the insulating layer, and a conductor post formed on a second surface of the conductor layer on the opposite side with respect to the first surface such that the conductor post has a side surface covered by the insulating layer. The conductor post has an end surface on the opposite with respect to the conductor layer such that the end surface of the conductor post is exposed on a second surface side of the insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the conductor layer.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract: A multilayer wiring board includes wiring bodies each including an insulating layer, a conductor layer embedded in the insulating layer and having exposed surface on first surface of the insulating layer, and a conductor post formed on embedded surface of the conductor layer on the opposite side and having end surface on second surface of the insulating layer. The bodies include first and second bodies forming outermost layers on the opposite sides, the exposed surface is recessed from the first surface of the insulating layer in the first body, the end surface is recessed from the second surface in the second body in recess amount greater than that of the exposed surface in the first body, the post of the first body has the exposed surface bonded to the conductor layer of an adjacent body, the second body has the conductor layer bonded to the post of an adjacent body.

Abstract: A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm.

Abstract: A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer.

Abstract: A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer.

Abstract: A printed wiring board includes a wiring conductor layer having first surface, conductor posts formed on second surface of the wiring layer, and an insulating layer embedding the wiring layer such that the first surface of the wiring layer is exposed on first surface of the insulating layer and covering side surfaces of the posts such that end surface of each conductor post is exposed from second surface of the insulating layer. The first surface of the wiring layer is recessed with respect to the first surface of the insulating layer and the end surface of each conductor post is recessed with respect to the second surface of the insulating layer such that distance between the end surface of each conductor post and the second surface of the insulating layer is greater than distance between the first surface of the wiring layer and the first surface of the insulating layer.

Abstract: A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer.

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract: Instant noodles are produced, which have an excellent reconstitution property, can be reconstituted by pouring of boiling water even if the noodles are thicker than before, and have excellent taste and texture. The instant noodles are produced by: making raw noodle strings each having a multilayer structure including three or more layers; spraying superheated steam to the raw noodle strings; gelatinizing the noodle strings to which the superheated steam has been sprayed; and drying the noodle strings which have been gelatinized. It is preferable to gelatinize the noodle strings by spraying the superheated steam to the noodle strings, supplying moisture in liquid form to the noodle strings, and further heating the noodle strings by using the superheated steam and/or saturated steam.