Patents by Inventor Shunsuke Takimoto
Shunsuke Takimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9825077Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: GrantFiled: July 22, 2015Date of Patent: November 21, 2017Assignee: Canon Kabushiki KaishaInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Patent number: 9570504Abstract: Provided is a method of manufacturing an imaging apparatus. The imaging apparatus is formed on a substrate and includes a pixel region and a peripheral circuit region that is arranged on a periphery of the pixel region. The method includes: forming an insulating layer in the pixel region and the peripheral circuit region; etching the insulating layer formed in the pixel region in a state in which the peripheral circuit region is protected; planarizing a surface of the insulating layer; and forming a waveguide in the pixel region. After the forming an insulating layer and before the etching the insulating layer, an average value of heights of a top surface of the insulating layer in the pixel region is larger than an average value of heights of a top surface of the insulating layer in the peripheral circuit region.Type: GrantFiled: August 27, 2015Date of Patent: February 14, 2017Assignee: CANON KABUSHIKI KAISHAInventors: Toshiyuki Ogawa, Sho Suzuki, Shunsuke Takimoto
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Patent number: 9373658Abstract: A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member.Type: GrantFiled: February 18, 2015Date of Patent: June 21, 2016Assignee: CANON KABUSHIKI KAISHAInventors: Takehito Okabe, Kentarou Suzuki, Takashi Usui, Taro Kato, Mineo Shimotsusa, Shunsuke Takimoto
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Publication number: 20160079302Abstract: Provided is a method of manufacturing an imaging apparatus. The imaging apparatus is formed on a substrate and includes a pixel region and a peripheral circuit region that is arranged on a periphery of the pixel region. The method includes: forming an insulating layer in the pixel region and the peripheral circuit region; etching the insulating layer formed in the pixel region in a state in which the peripheral circuit region is protected; planarizing a surface of the insulating layer; and forming a waveguide in the pixel region. After the forming an insulating layer and before the etching the insulating layer, an average value of heights of a top surface of the insulating layer in the pixel region is larger than an average value of heights of a top surface of the insulating layer in the peripheral circuit region.Type: ApplicationFiled: August 27, 2015Publication date: March 17, 2016Inventors: Toshiyuki Ogawa, Sho Suzuki, Shunsuke Takimoto
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Publication number: 20150325610Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: ApplicationFiled: July 22, 2015Publication date: November 12, 2015Inventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Publication number: 20150179700Abstract: A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member.Type: ApplicationFiled: February 18, 2015Publication date: June 25, 2015Inventors: Takehito Okabe, Kentarou Suzuki, Takashi Usui, Taro Kato, Mineo Shimotsusa, Shunsuke Takimoto
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Patent number: 8987852Abstract: A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member.Type: GrantFiled: February 3, 2012Date of Patent: March 24, 2015Assignee: Canon Kabushiki KaishaInventors: Takehito Okabe, Kentarou Suzuki, Taskashi Usui, Taro Kato, Mineo Shimotsusa, Shunsuke Takimoto
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Patent number: 8411187Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: GrantFiled: March 4, 2011Date of Patent: April 2, 2013Assignee: Canon Kabushiki KaishaInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Publication number: 20120199893Abstract: A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member.Type: ApplicationFiled: February 3, 2012Publication date: August 9, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Takehito Okabe, Kentarou Suzuki, Takashi Usui, Taro Kato, Mineo Shimotsusa, Shunsuke Takimoto
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Publication number: 20110157447Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: ApplicationFiled: March 4, 2011Publication date: June 30, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Patent number: 7920192Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: GrantFiled: July 6, 2007Date of Patent: April 5, 2011Assignee: Canon Kabushiki KaishaInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Publication number: 20110003426Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: ApplicationFiled: September 14, 2010Publication date: January 6, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi
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Patent number: 7592578Abstract: A photoelectric-conversion apparatus includes a photoelectric-conversion area where a plurality of photoelectric-conversion elements configured to convert incident light into electrical charges, a plurality of floating-diffusion areas, a plurality of transfer-MOS transistors configured to transfer electrical charges of the photoelectric-conversion element to the floating-diffusion area, and a plurality of amplification-MOS transistors configured to read and transmit a signal generated based on the transferred electrical charges to an output line are provided. An antireflection film is provided on a light-receiving surface of the photoelectric-conversion element. The gate of the amplification-MOS transistor is electrically connected to one floating-diffusion area by providing one conductor in a single contact hole, and the anti-reflection film covers the photoelectric-conversion area except a base part of the contact hole.Type: GrantFiled: July 7, 2008Date of Patent: September 22, 2009Assignee: Canon Kabushiki KaishaInventors: Mineo Shimotsusa, Shigeru Nishimura, Shunsuke Takimoto
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Publication number: 20090011532Abstract: A photoelectric-conversion apparatus includes a photoelectric-conversion area where a plurality of photoelectric-conversion elements configured to convert incident light into electrical charges, a plurality of floating-diffusion areas, a plurality of transfer-MOS transistors configured to transfer electrical charges of the photoelectric-conversion element to the floating-diffusion area, and a plurality of amplification-MOS transistors configured to read and transmit a signal generated based on the transferred electrical charges to an output line are provided. An antireflection film is provided on a light-receiving surface of the photoelectric-conversion element. The gate of the amplification-MOS transistor is electrically connected to one floating-diffusion area by providing one conductor in a single contact hole, and the anti-reflection film covers the photoelectric-conversion area except a base part of the contact hole.Type: ApplicationFiled: July 7, 2008Publication date: January 8, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Mineo Shimotsusa, Shigeru Nishimura, Shunsuke Takimoto
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Patent number: 7411170Abstract: A photoelectric-conversion apparatus includes a photoelectric-conversion area where a plurality of photoelectric-conversion elements configured to convert incident light into electrical charges, a plurality of floating-diffusion areas, a plurality of transfer-MOS transistors configured to transfer electrical charges of the photoelectric-conversion element to the floating-diffusion area, and a plurality of amplification-MOS transistors configured to read and transmit a signal generated based on the transferred electrical charges to an output line are provided. An antireflection film is provided on a light-receiving surface of the photoelectric-conversion element. The gate of the amplification-MOS transistor is electrically connected to one floating-diffusion area by providing one conductor in a single contact hole, and the anti-reflection film covers the photoelectric-conversion area except a base part of the contact hole.Type: GrantFiled: August 7, 2007Date of Patent: August 12, 2008Assignee: Canon Kabushiki KaishaInventors: Mineo Shimotsusa, Shigeru Nishimura, Shunsuke Takimoto
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Publication number: 20080054165Abstract: A photoelectric-conversion apparatus includes a photoelectric-conversion area where a plurality of photoelectric-conversion elements configured to convert incident light into electrical charges, a plurality of floating-diffusion areas, a plurality of transfer-MOS transistors configured to transfer electrical charges of the photoelectric-conversion element to the floating-diffusion area, and a plurality of amplification-MOS transistors configured to read and transmit a signal generated based on the transferred electrical charges to an output line are provided. An antireflection film is provided on a light-receiving surface of the photoelectric-conversion element. The gate of the amplification-MOS transistor is electrically connected to one floating-diffusion area by providing one conductor in a single contact hole, and the anti-reflection film covers the photoelectric-conversion area except a base part of the contact hole.Type: ApplicationFiled: August 7, 2007Publication date: March 6, 2008Applicant: CANON KABUSHIKI KAISHAInventors: Mineo Shimotsusa, Shigeru Nishimura, Shunsuke Takimoto
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Publication number: 20080029793Abstract: A photoelectric conversion device includes a photoelectric conversion region having a plurality of photoelectric conversion elements and a first MOS transistor configured to read a signal in response to an electric charge of each photoelectric conversion element; and a peripheral circuit region having a second MOS transistor configured to drive the first MOS transistor and/or amplify the signal read from the photoelectric conversion region, the photoelectric conversion region and the peripheral circuit region being located on the same semiconductor substrate, wherein an impurity concentration in a drain of the first MOS transistor is lower than an impurity concentration in a drain of the second MOS transistor.Type: ApplicationFiled: July 6, 2007Publication date: February 7, 2008Applicant: CANON KABUSHIKI KAISHAInventors: Takanori Watanabe, Tetsuya Itano, Hidekazu Takahashi, Shunsuke Takimoto, Kotaro Abukawa, Hiroaki Naruse, Shigeru Nishimura, Masatsugu Itahashi