Patents by Inventor Shusaku Okamyo

Shusaku Okamyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8530119
    Abstract: A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: September 10, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Takashi Hirano, Toshio Banba, Shusaku Okamyo, Hiroaki Makabe
  • Publication number: 20120100484
    Abstract: A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
    Type: Application
    Filed: May 20, 2009
    Publication date: April 26, 2012
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Takashi Hirano, Toshio Banba, Shusaku Okamyo, Hiroaki Makabe
  • Patent number: 7678514
    Abstract: A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: March 16, 2010
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Hiromichi Sugiyama, Toshio Banba, Shusaku Okamyo
  • Publication number: 20090170026
    Abstract: A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Hiromichi SUGIYAMA, Toshio Banba, Shusaku Okamyo