Abstract: A substrate fixing device includes a base plate including therein a gas supply section, and an electrostatic chuck provided on the base plate. The electrostatic chuck includes a base having a mounting surface on which a target to be held by electrostatic attraction is mounted, an insertion hole, penetrating the base, having an inner surface that defines the insertion hole and is threaded to form a female thread, and a screw member, having an outer surface that is threaded to form a male thread, and inserted into the insertion hole to assume a mated state in which the male thread mates with the female thread. A gas from the gas supply section is supplied to the mounting surface via the screw member.

Abstract: A substrate fixing device includes a base plate including therein a gas supply section, and an electrostatic chuck provided on the base plate. The electrostatic chuck includes a base having a mounting surface on which a target to be held by electrostatic attraction is mounted, an insertion hole, penetrating the base, having an inner surface that defines the insertion hole and is threaded to foLm a female thread, and a screw member, having an outer surface that is threaded to form a male thread, and inserted into the insertion hole to assume a mated state in which the male thread mates with the female thread. A gas from the gas supply section is supplied to the mounting surface via the screw member.

Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.

Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

Abstract: A radiator plate 20 is mounted on a back surface of a semiconductor element 11 on a substrate 10 so that heat is radiated from the semiconductor element 11. The radiator plate 20 includes first radiating fins 20b formed on the one side which is opposite to the surface facing the substrate 10 and second radiating fins 20c formed on the other side which faces the substrate 10. The second radiating fins 20c are arranged in the same direction as the first radiating fins 20b and at positions not interfering the semiconductor element 11.

Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.

Abstract: Spontaneously cross-linked alkali metal acrylate polymers having a high water-absorbing property and which are safe for contact with the human skin are prepared by a water-in-oil suspension polymerization process, using a sorbitan fatty acid ester having an HLB value of 3 to 6 as a dispersing agent.