Patents by Inventor Shuzo Umezu

Shuzo Umezu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10253405
    Abstract: A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 9, 2019
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Akira Saito, Shuzo Umezu, Ryo Iino
  • Publication number: 20150000803
    Abstract: A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.
    Type: Application
    Filed: December 22, 2011
    Publication date: January 1, 2015
    Applicant: Mitsubishi Shindoh Co., Ltd
    Inventors: Jun-Ichi Kumagai, Yoshio Abe, Akira Saito, Shuzo Umezu, Ryo Iino
  • Patent number: 7029760
    Abstract: A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 ?m.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: April 18, 2006
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Akihito Mori, Takeshi Suzuki, Tadao Sakakibara, Shuzo Umezu, Masahiko Ishida
  • Publication number: 20040229077
    Abstract: A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 &mgr;m.
    Type: Application
    Filed: July 10, 2003
    Publication date: November 18, 2004
    Inventors: Akihito Mori, Takeshi Suzuki, Tadao Sakakibara, Shuzo Umezu, Masahiko Ishida