Patents by Inventor Shwang-Min Jeng

Shwang-Min Jeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7015136
    Abstract: A method for preventing formation of photoresist scum. First, a substrate on which a dielectric layer is formed is provided. Next, a non-nitrogen anti-reflective layer is formed on the dielectric layer. Finally, a photoresist pattern layer is formed on the non-nitrogen anti-reflective layer. During the formation of the photoresist pattern layer, the non-nitrogen anti-reflective layer does not react with the photoresist pattern layer, thus not forming photoresist scum. This prevents undesired etching profile and critical dimension (CD) change due to presence of photoresist scum. The non-nitrogen anti-reflective layer can be silicon-rich oxide (SiOx) or hydrocarbon-containing silicon-rich oxide (SiOxCy:H).
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: March 21, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-I Bao, Shwang-Min Jeng, Syun-Ming Jang
  • Publication number: 20050064629
    Abstract: An interconnect structure utilizing a silicon carbon-containing film as an interlayer between dielectrics. A semiconductor substrate having a conductor thereon is provided, and an insulating layer overlies the semiconductor substrate. The insulating layer has a via hole therein to expose the conductor. A conductive plug, e.g. a tungsten plug, substantially fills the via hole and electrically connects the underlying conductor. A silicon carbon-containing film and a low k dielectric layer overlie the insulating layer and the conductive plug, and have a trench therein exposing the conductive plug. A copper or copper alloy conductor substantially fills the trench.
    Type: Application
    Filed: September 22, 2003
    Publication date: March 24, 2005
    Inventors: Chen-Hua Yu, Tsu Shih, Chung-Shi Liu, Shwang-Min Jeng, Horng-Huei Tseng
  • Publication number: 20050006340
    Abstract: A method for preventing formation of photoresist scum. First, a substrate on which a dielectric layer is formed is provided. Next, a non-nitrogen anti-reflective layer is formed on the dielectric layer. Finally, a photoresist pattern layer is formed on the non-nitrogen anti-reflective layer. During the formation of the photoresist pattern layer, the non-nitrogen anti-reflective layer does not react with the photoresist pattern layer, thus not forming photoresist scum. This prevents undesired etching profile and critical dimension (CD) change due to presence of photoresist scum. The non-nitrogen anti-reflective layer can be silicon-rich oxide (SiOx) or hydrocarbon-containing silicon-rich oxide (SiOxCy:H).
    Type: Application
    Filed: July 10, 2003
    Publication date: January 13, 2005
    Inventors: Tien-I Bao, Shwang-Min Jeng, Syun-Ming Jang