Patents by Inventor Siang Goh
Siang Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240009631Abstract: There is provided a method of forming a cross-linked polymeric membrane, the method comprising: contacting a polymeric membrane with a cross-linking solution to form the cross-linked polymeric membrane, wherein the cross?linking solution comprises a cross-linker comprising at least one acyl halide functional group dissolved in a polar protic solvent. There is also provided a cross-linked polymeric membrane. In a preferred embodiment, hollow fiber polybenzimidazole (PBI) is crosslinked by trimesoyl chloride (TMC) or isophthaloyl chloride (I PC) in a solvent of ethanol or isopropyl alcohol (IPA).Type: ApplicationFiled: October 13, 2021Publication date: January 11, 2024Applicant: Seppure Pte LtdInventors: Mohammad Hossein Davood Abadi FARAHANI, Alfred Jun Jie TAY, Keng Siang GOH
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Publication number: 20220187508Abstract: A liquid lens can include a cavity, a first liquid disposed within the cavity, and a second liquid disposed within the cavity. A focus of the liquid lens can be adjustable by adjusting a shape of a variable interface defined by the first liquid and the second liquid. Upon adjusting the focus of the liquid lens in a periodic oscillation with a peak-to-valley amplitude of 20 diopter and a frequency of 2 Hz, a root mean square (RMS) wavefront error (WFE) of the liquid lens measured at 1 ms intervals can remain at 100 nm or less throughout one complete cycle of the periodic oscillation.Type: ApplicationFiled: March 12, 2020Publication date: June 16, 2022Inventors: John D Duke, Kee Siang Goh, Raymond Miller Karam, Joseph Marshall Kunick, Paul Michael Then, Thomas Mikio Wynne
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Patent number: 9694526Abstract: Systems and methods of providing a tooling system for forming a unitary housing are disclosed herein. One embodiment may utilize a plurality of injection cavity slides. The slides may form the interior cavity of the housing. Utilizing a plurality of injection cavity slides to form a single cavity insert may allow the slides to be remove from an opening in the housing which is smaller than the cavity of the housing. Removing the slides from housing allows for the formation of housing having a unitary structure.Type: GrantFiled: September 26, 2013Date of Patent: July 4, 2017Assignee: Apple Inc.Inventors: Cesar Lozano Villarreal, Richard J. Langlois, Alexander Kwan, Ciaran Keane, Dominic E. Dolci, Chiew-Siang Goh, Bruce E. Berg
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Patent number: 9691688Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.Type: GrantFiled: October 26, 2015Date of Patent: June 27, 2017Assignee: CARSEM (M) SDN. BHD.Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
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Publication number: 20160049357Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.Type: ApplicationFiled: October 26, 2015Publication date: February 18, 2016Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
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Publication number: 20160044831Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.Type: ApplicationFiled: August 10, 2015Publication date: February 11, 2016Inventors: Chiew-Siang Goh, Houtan R. Farahani, Eric A. Knopf, Ricardo A. Mariano, Joseph B. Moak, Matthew S. Theobald
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Patent number: 9207724Abstract: Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.Type: GrantFiled: March 26, 2013Date of Patent: December 8, 2015Assignee: Apple Inc.Inventors: Daniel J. Coster, Daniele G. De Iuliis, Chiew-Siang Goh, Douglas L. Heirich, Steven W. Holmes, Jonathan P. Ive, Sung H. Kim, Ricardo A. Mariano, Thomas J. Misage, Daniel J. Riccio, Tang Y. Tan, Jeremy Yaekel
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Patent number: 9190385Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.Type: GrantFiled: October 30, 2007Date of Patent: November 17, 2015Assignee: Carsem (M) SDN. BHD.Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
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Patent number: 9132562Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.Type: GrantFiled: May 3, 2013Date of Patent: September 15, 2015Assignee: Apple Inc.Inventors: Chiew-Siang Goh, Houtan R. Farahani, Eric A. Knopf, Ricardo A. Mariano, Joseph B. Moak, Matthew S. Theobald
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Patent number: 9095076Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.Type: GrantFiled: May 6, 2014Date of Patent: July 28, 2015Assignee: Apple Inc.Inventors: Vinh Diep, Chiew-Siang Goh, Doug Heirich, Alexander Michael Kwan, Cesar Lozano Villarreal
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Patent number: 9048124Abstract: An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.Type: GrantFiled: September 20, 2012Date of Patent: June 2, 2015Assignee: Apple Inc.Inventors: Dominic E. Dolci, James G. Smeenge, Vinh H. Diep, Chiew-Siang Goh
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Publication number: 20140293545Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.Type: ApplicationFiled: May 6, 2014Publication date: October 2, 2014Applicant: Apple Inc.Inventors: Vinh Diep, Chiew-Siang Goh, Doug Heirich, Alexander Michael Kwan, Cesar Lozano Villarreal
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Publication number: 20140265763Abstract: Systems and methods of providing a tooling system for forming a unitary housing are disclosed herein. One embodiment may utilize a plurality of injection cavity slides. The slides may form the interior cavity of the housing. Utilizing a plurality of injection cavity slides to form a single cavity insert may allow the slides to be remove from an opening in the housing which is smaller than the cavity of the housing. Removing the slides from housing allows for the formation of housing having a unitary structure.Type: ApplicationFiled: September 26, 2013Publication date: September 18, 2014Applicant: Apple Inc.Inventors: Cesar Lozano Villarreal, Richard J. Langlois, Alexander Kwan, Ciaran Keane, Dominic E. Dolci, Chiew-Siang Goh, Bruce E. Berg
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Publication number: 20140211432Abstract: This application relates generally to a multipurpose fastener for an electronic device. More specifically, the multipurpose fastener is configured to both mechanically restrain at least one circuit board within a housing of an electronic device and to electrically couple at least one circuit board to the housing. In some embodiments, the fastener is configured to constrain two printed circuit boards such that they are disposed substantially parallel to one another. A conductive sleeve can be utilized to establish a predefined distance between the two circuit boards and to provide a conduit through which power can be transferred.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: Apple Inc.Inventors: Cesar LOZANO, Dominic E. Dolci, Chiew-Siang Goh
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Patent number: 8760868Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.Type: GrantFiled: August 30, 2011Date of Patent: June 24, 2014Assignee: Apple Inc.Inventors: Vinh Diep, Chiew-Siang Goh, Doug Heirich, Alexander Michael Kwan, Cesar Lozano Villarreal
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Publication number: 20140078677Abstract: An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.Type: ApplicationFiled: September 20, 2012Publication date: March 20, 2014Inventors: Dominic E. Dolci, James G. Smeenge, Vinh H. Diep, Chiew-Siang Goh
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Publication number: 20130328484Abstract: Connector adapters that may allow contacts in a connector insert to form electrical connections with contacts in an incompatible connector receptacle. One example may provide a connector adapter for providing a connection between a connector insert and an incompatible connector receptacle. The connector adapter may be a magnetic connector providing a magnetic connector receptacle at a first end to accept a connector insert having an attraction plate. This connector adapter may further provide a connector insert having an attraction plate at a second end to insert into a magnetic connector receptacle on an electrical device.Type: ApplicationFiled: June 8, 2012Publication date: December 12, 2013Applicant: Apple Inc.Inventors: Cesar Lozano Villarreal, James G. Smeenge, Chiew-Siang Goh
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Publication number: 20130229764Abstract: Quick release couplings for releasably coupling components to the computer are disclosed. The quick release coupling mechanisms are generally configured to allow tool-less placement of the components relative to the computer. That is, the quick release coupling mechanisms are configured to perform their couplings without using conventional fasteners such as screws, bolts, etc. By eliminating use of fasteners, the components may be inserted and removed from the computer without using tools (e.g., tool-less). Furthermore, the quick release couplings are easy to maneuver thereby enabling quick and straightforward assembly and disassembly of the components to and from the computer (e.g., quick release). For example, the components may be inserted and removed by a simple pushing or pulling motion, and/or by a simple flick of a latch or handle.Type: ApplicationFiled: March 26, 2013Publication date: September 5, 2013Inventors: Daniel J. COSTER, Daniele G. De IULIIS, Chiew-Siang GOH, Douglas L. HEIRICH, Steven W. HOLMES, Jonathan P. IVE, Sung H. KIM, Ricardo A. MARIANO, Thomas J. MISAGE, Daniel J. RICCIO, Tang Y. TAN, Jeremy YAEKEL
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Patent number: 8451598Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.Type: GrantFiled: September 29, 2010Date of Patent: May 28, 2013Assignee: Apple Inc.Inventors: Chiew-Siang Goh, Joseph B. Moak, Matthew S. Theobald, Houtan R. Farahani, Ricardo A. Mariano, Eric A. Knopf
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Patent number: 8450757Abstract: The light-emitting device includes a light source and a gradient index (GRIN) element. The GRIN element has a cylindrical refractive index profile in which the refractive index varies radially and is substantially constant axially. The GRIN element includes a first end surface opposite a second end surface and is characterized by a length-to-pitch ratio. The GRIN element is arranged with the first end surface adjacent the light source to receive light from the light source, and emits the light from the second end surface in a radiation pattern dependent on the length-to-pitch ratio. Since the radiation pattern depends on the length-to-pitch ratio of the GRIN element, LEDs with different radiation patterns can be made simply by using GRIN elements of appropriate lengths.Type: GrantFiled: May 24, 2006Date of Patent: May 28, 2013Assignee: Intellectual Discovery Co., Ltd.Inventor: Kee Siang Goh