Abstract: Interconnections for modular die designs are disclosed. In one aspect, a die that is a chiplet is designed and tested for suitability. After approval of the chiplet design, multiple dies or chiplets may be coupled together within a multi-die package to form a package having desired computing capabilities. After assembly, each chiplet is provided a unique identifier, such as by setting a fuse. Based on the unique identifier, each chiplet is made aware of how interfaces to other chiplets are configured so that signals may be routed appropriately. Using modular chiplets in this fashion reduces testing requirements and non-recurring expenses while increasing flexibility for design options.

Abstract: Interconnections for modular die designs are disclosed. In one aspect, a die that is a chiplet is designed and tested for suitability. After approval of the chiplet design, multiple dies or chiplets may be coupled together within a multi-die package to form a package having desired computing capabilities. After assembly, each chiplet is provided a unique identifier, such as by setting a fuse. Based on the unique identifier, each chiplet is made aware of how interfaces to other chiplets are configured so that signals may be routed appropriately. Using modular chiplets in this fashion reduces testing requirements and non-recurring expenses while increasing flexibility for design options.

Abstract: Systems, methods, and computer programs are disclosed for managing memory channel connectivity. One embodiment of a system comprises a high-bandwidth memory client, a low-bandwidth memory client, and an address translator. The high-bandwidth memory client is electrically coupled to each of a plurality of memory channels via an interconnect. The low-bandwidth memory client is electrically coupled to only a portion of the plurality of memory channels via the interconnect. The address translator is in communication with the high-bandwidth memory client and configured to perform physical address manipulation when a memory page to be accessed by the high-bandwidth memory client is shared with the low-bandwidth memory client.

Abstract: Systems, methods, and computer programs are disclosed for dynamically adjusting memory channel interleave granularity. An embodiment of a system comprises a plurality of memory clients, a memory management unit (MMU), and an address translator. The plurality of memory clients are electrically coupled to each of a plurality of memory channels via an interconnect. The MMU is configured to receive a request for a memory allocation request for one or more memory pages from one of the plurality of memory client and, in response, select one of a plurality of interleave granularities for the one or more memory pages. The address translator is configured to translate a physical address to interleave memory data associated with the one or more memory pages at the selected interleave granularity.

Abstract: Systems, methods, and computer programs are disclosed for dynamically adjusting memory channel interleave granularity. An embodiment of a system comprises a plurality of memory clients, a memory management unit (MMU), and an address translator. The plurality of memory clients are electrically coupled to each of a plurality of memory channels via an interconnect. The MMU is configured to receive a request for a memory allocation request for one or more memory pages from one of the plurality of memory client and, in response, select one of a plurality of interleave granularities for the one or more memory pages. The address translator is configured to translate a physical address to interleave memory data associated with the one or more memory pages at the selected interleave granularity.

Abstract: Systems, methods, and computer programs are disclosed for managing memory channel connectivity. One embodiment of a system comprises a high-bandwidth memory client, a low-bandwidth memory client, and an address translator. The high-bandwidth memory client is electrically coupled to each of a plurality of memory channels via an interconnect. The low-bandwidth memory client is electrically coupled to only a portion of the plurality of memory channels via the interconnect. The address translator is in communication with the high-bandwidth memory client and configured to perform physical address manipulation when a memory page to be accessed by the high-bandwidth memory client is shared with the low-bandwidth memory client.