Abstract: Power fuses having filler material including hydrated zeolite material facilitates increasing power density of electrical fuses in reduced package sizes. The hydrated zeolite material releases water to cool and suppress electrical arcing conditions experienced in higher power circuitry.

Abstract: Power fuses having filler material including hydrated zeolite material facilitates increasing power density of electrical fuses in reduced package sizes. The hydrated zeolite material releases water to cool and suppress electrical arcing conditions experienced in higher power circuitry.

Abstract: Power fuses having filler material including hydrated zeolite material facilitates increasing power density of electrical fuses in reduced package sizes. The hydrated zeolite material releases water to cool and suppress electrical arcing conditions experienced in higher power circuitry.

Abstract: Power fuses having filler material including hydrated zeolite material facilitates increasing power density of electrical fuses in reduced package sizes. The hydrated zeolite material releases water to cool and suppress electrical arcing conditions experienced in higher power circuitry.

Abstract: The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.

Abstract: Subminiature surface mount chip fuses include two part housings enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are assembled to the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.

Abstract: Subminiature surface mount chip fuses include two part housings enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are assembled to the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.

Abstract: The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.

Abstract: A low switching temperature PTC device. The device includes a polymeric compound including a low melting temperature polyethylene, a plasticizer, and two types of carbon black.

Abstract: A direct extrusion process for manufacturing conductive polymer articles of manufacture employs a twin screw compounding extruder that compounds a polymeric mixture from materials received, in predetermined proportions, from gravimetric feeders, then extrudes a compounded conductive polymeric material in the melt phase. The extrudate is then fed into a gear pump that allows the extruder to discharge the compounded material, while it is still in the melt stage, at a relatively low pressure. The gear pump produces a substantially constant volumetric output of the compounded "melt phase" material at sufficiently high pressure for delivery into a sheet die. The sheet die forms the compounded material, while still in the melt phase, into a continuous web.

Abstract: A direct extrusion process for manufacturing conductive polymer articles of manufacture employs a twin screw compounding extruder that compounds a polymeric mixture from materials received, in predetermined proportions, from gravimetric feeders, then extrudes a compounded conductive polymeric material in the melt phase. The extrudate is then fed into a gear pump that allows the extruder to discharge the compounded material, while it is still in the melt stage, at a relatively low pressure. The gear pump produces a substantially constant volumetric output of the compounded "melt phase" material at sufficiently high pressure for delivery into a sheet die. The sheet die forms the compounded material, while still in the melt phase, into a continuous web.