Patents by Inventor Sidharth Bhatia
Sidharth Bhatia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240061409Abstract: A method includes identifying sets of part data associated with substrate processing equipment. Each of the sets of part data includes corresponding part values and a corresponding part identifier. Each of the sets of part data is associated with hardware parameters of a corresponding equipment part of substrate processing equipment. The method further includes generating sets of aggregated data. Each of the sets of aggregated data includes a corresponding set of part data of the sets of part data and a corresponding set of additional non-part data of sets of non-part data. The method further includes causing, based on the sets of aggregated data, performance of a corrective action associated with the substrate processing equipment.Type: ApplicationFiled: October 26, 2023Publication date: February 22, 2024Inventors: Garrett Ho-Yee Sin, Sidharth Bhatia, Katty Marie Lydia Gamon Guyomard, Shawyon Jafari, Heng-Cheng Pai, Pramod Nambiar, Paul Lukas Brillhart, Ilker Durukan
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Publication number: 20240046096Abstract: Disclosed herein is technology for performing predictive modeling to identify inputs for a manufacturing process.Type: ApplicationFiled: October 18, 2023Publication date: February 8, 2024Inventors: Sidharth Bhatia, Dermot Cantwell, Serghei Malkov, Jie Feng
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Patent number: 11853042Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.Type: GrantFiled: February 17, 2021Date of Patent: December 26, 2023Assignee: Applied Materials, Inc.Inventors: Garrett Ho-Yee Sin, Sidharth Bhatia, Katty Marie Lydia Gamon Guyomard, Shawyon Jafari, Heng-Cheng Pai, Pramod Nambiar, Paul Lukas Brillhart, Ilker Durukan
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Publication number: 20230411119Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Inventors: Jie Yu, Yue Guo, Kartik Ramaswamy, Tao Zhang, Shahid Rauf, John Forster, Sidharth Bhatia, Rong Gang Zheng
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Patent number: 11829873Abstract: Disclosed herein is technology for performing predictive modeling to identify inputs for a manufacturing process. An example method may include receiving expected output data for a manufacturing process, wherein the expected output data defines an attribute of an output of the manufacturing process; accessing a plurality of machine learning models that model the manufacturing process; determining, using a first machine learning model, input data for the manufacturing process based on the expected output data for the manufacturing process, wherein the input data comprises a value for a first input and a value for a second input; combining the input data determined using the first machine learning model with input data determined using the second machine learning model to produce a set of inputs for the manufacturing process, wherein the set of inputs comprises candidate values for the first input and candidate values for the second input.Type: GrantFiled: May 21, 2020Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Sidharth Bhatia, Dermot Cantwell, Serghei Malkov, Jie Feng
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Publication number: 20230367288Abstract: Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, generating a design of experiment (DoE) using the HOW analytics, implementing process optimization, and releasing an iteration of the process recipe. In an embodiment, the method further comprises margin testing the iteration of the process recipe.Type: ApplicationFiled: May 16, 2022Publication date: November 16, 2023Inventors: Jeong Jin Hong, Mi Hyun Jang, Sidharth Bhatia, Sejune Cheon, Joshua Maher, Upendra Ummethala
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Publication number: 20230295799Abstract: A method includes receiving, by a processing device, first data from an optical sensor of a processing chamber. The method further includes processing the first data to obtain second data. The second data includes an indication of a condition of a coating on an interior surface of the processing chamber. The method further includes generating an indication of performance of a processing operation of the processing chamber in view of the second data. The method further includes causing performance of a corrective action in view of the indication of performance of the processing chamber.Type: ApplicationFiled: March 16, 2022Publication date: September 21, 2023Inventors: Jeffrey Yat Shan Au, Sidharth Bhatia, Zhaozhao Zhu, Nicholas Ryan Pica, Varoujan Chakarian, Chenfei Hu
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Publication number: 20230298872Abstract: A method includes receiving, by a processing device, first sensor data indicating a state of a wall corresponding to a first processing chamber. The first sensor data includes optical spectral data. The method further includes determining, by the processing device, a first value based on the first sensor data. The first value corresponds to a first amount of a product disposed along a surface of the wall at a first time. The method further includes determining, by the processing device, a first update to a first process operation associated with the first processing chamber based on the first value. The method further includes performing, by the processing device, one or more of (i) preparing a notification indicating the first update for presentation on a graphical user interface (GUI), or (ii) causing performance of the first process operation in accordance with the first update.Type: ApplicationFiled: March 16, 2022Publication date: September 21, 2023Inventors: Jeffrey Yat Shan Au, Joshua Thomas Maher, Varoujan Chakarian, Sidharth Bhatia, Patrick Tae, Zhaozhao Zhu, Blake W. Erickson
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Publication number: 20230205196Abstract: A method includes identifying sets of sensor data associated with wafers processed via wafer processing equipment and identifying sets of metrology data associated with the wafers processed via the wafer processing equipment. The method further includes generating sets of aggregated sensor-metrology data, each of the sets of aggregated sensor-metrology data including a respective set of sensor data and a respective set of metrology data. The method further includes causing, based on the sets of aggregated sensor-metrology data, performance of a corrective action associated with the wafer processing equipment.Type: ApplicationFiled: February 27, 2023Publication date: June 29, 2023Inventors: Sidharth Bhatia, Garrett H. Sin, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil
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Patent number: 11592812Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model.Type: GrantFiled: February 14, 2020Date of Patent: February 28, 2023Assignee: Applied Materials, Inc.Inventors: Sidharth Bhatia, Garrett H. Sin, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil
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Patent number: 11545376Abstract: Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.Type: GrantFiled: July 28, 2020Date of Patent: January 3, 2023Assignee: Applied Materials, Inc.Inventors: Sidharth Bhatia, Edward P. Hammond, IV, Bhaskar Kumar, Anup Kumar Singh, Vivek Bharat Shah, Ganesh Balasubramanian
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Patent number: 11495440Abstract: Embodiments of the present disclosure generally relate to apparatuses for reducing particle contamination on substrates in a plasma processing chamber. In one or more embodiments, an edge ring is provided and includes a top surface, a bottom surface opposite the top surface and extending radially outward, an outer vertical wall extending between and connected to the top surface and the bottom surface, an inner vertical wall opposite the outer vertical wall, an inner lip extending radially inward from the inner vertical wall, and an inner step disposed between and connected to the inner wall and the bottom surface. During processing, the edge ring shifts the high plasma density zone away from the edge area of the substrate to avoid depositing particles on the substrate when the plasma is de-energized.Type: GrantFiled: August 18, 2020Date of Patent: November 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Bhaskar Kumar, Prashanth Kothnur, Sidharth Bhatia, Anup Kumar Singh, Vivek Bharat Shah, Ganesh Balasubramanian, Changgong Wang
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Publication number: 20220328366Abstract: A method includes: receiving film property data associated with manufacturing parameters of manufacturing equipment; determining that the film property data is correlated and is different from target data; selecting, by a processing device, a set of data points of the film property data that are orthogonal to the target data; performing, by the processing device, feature extraction on the set of data points; and determining, based on the feature extraction, updates to one or more of the manufacturing parameters to meet the target data.Type: ApplicationFiled: May 6, 2022Publication date: October 13, 2022Inventors: Sidharth Bhatia, Jie Feng, Dermot Cantwell
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Publication number: 20220260978Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.Type: ApplicationFiled: February 17, 2021Publication date: August 18, 2022Inventors: Garrett Ho-Yee Sin, Sidharth Bhatia, Katty Marie Lydia Gamon Guyomard, Shawyon Jafari, Heng-Cheng Pai, Pramod Nambiar, Paul Lukas Brillhart, Ilker Durukan
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Patent number: 11328964Abstract: Methods, systems, and non-transitory computer readable medium are described for prescriptive analytics in highly collinear response space. A method includes receiving film property data associated with manufacturing parameters of manufacturing equipment. The method further includes determining that the film property data is correlated and is different from target data. The method further includes selecting a set of data points of the film property data that are orthogonal to the target data. The method further includes performing feature extraction on the set of data points. The method further includes determining, based on the feature extraction, updates to one or more of the manufacturing parameters to meet the target data.Type: GrantFiled: October 11, 2019Date of Patent: May 10, 2022Assignee: Applied Materials, Inc.Inventors: Sidharth Bhatia, Jie Feng, Dermot Cantwell
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Publication number: 20210365770Abstract: Disclosed herein is technology for performing predictive modeling to identify inputs for a manufacturing process. An example method may include receiving expected output data for a manufacturing process, wherein the expected output data defines an attribute of an output of the manufacturing process; accessing a plurality of machine learning models that model the manufacturing process; determining, using a first machine learning model, input data for the manufacturing process based on the expected output data for the manufacturing process, wherein the input data comprises a value for a first input and a value for a second input; combining the input data determined using the first machine learning model with input data determined using the second machine learning model to produce a set of inputs for the manufacturing process, wherein the set of inputs comprises candidate values for the first input and candidate values for the second input.Type: ApplicationFiled: May 21, 2020Publication date: November 25, 2021Inventors: Sidharth Bhatia, Dermot Cantwell, Serghei Malkov, Jie Feng
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Patent number: 11157661Abstract: A process development visualization tool generates a first visualization of a parameter associated with a manufacturing process, and provides a GUI control element associated with a process variable of the manufacturing process, wherein the GUI control element has a first setting associated with a first value for the process variable. The process development tool receives a user input to adjust the GUI control element from the first setting to a second setting, determines a second value for the process variable based on the second setting, and determines a second set of values for the parameter that are associated with the second value for the process variable. The process development tool then generates a second visualization of the parameter, wherein the second visualization represents the second set of values for the parameter that are associated with the second value for the process variable.Type: GrantFiled: December 16, 2019Date of Patent: October 26, 2021Assignee: Applied Materials, Inc.Inventors: Vinayak Veer Vats, Sidharth Bhatia, Garrett Ho-Yee Sin, Pramod Nambiar, Hang Yu, Sanjay Kamath, Deenesh Padhi, Heng-Cheng Pai
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Patent number: 11120976Abstract: A method and apparatus for operating a plasma processing chamber includes performing a plasma process at a process pressure and a pressure power to generate a plasma. A first ramping-down stage starts in which the process power and the process pressure are ramped down substantially simultaneously to an intermediate power level and an intermediate pressure level, respectively. The intermediate power level and intermediate pressure level are preselected so as to raise a plasma sheath boundary above a threshold height from a surface of a substrate. A purge gas is flowed from a showerhead assembly at a sufficiently high rate to sweep away contaminant particles trapped in the plasma such that one or more contaminant particles move outwardly of an edge of the substrate. A second ramping-down stage starts where the intermediate power level and the intermediate pressure level decline to a zero level and a base pressure, respectively.Type: GrantFiled: July 13, 2020Date of Patent: September 14, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Bhaskar Kumar, Anup Kumar Singh, Vivek Bharat Shah, Sidharth Bhatia, Ganesh Balasubramanian
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Publication number: 20200381222Abstract: Embodiments of the present disclosure generally relate to apparatuses for reducing particle contamination on substrates in a plasma processing chamber. In one or more embodiments, an edge ring is provided and includes a top surface, a bottom surface opposite the top surface and extending radially outward, an outer vertical wall extending between and connected to the top surface and the bottom surface, an inner vertical wall opposite the outer vertical wall, an inner lip extending radially inward from the inner vertical wall, and an inner step disposed between and connected to the inner wall and the bottom surface. During processing, the edge ring shifts the high plasma density zone away from the edge area of the substrate to avoid depositing particles on the substrate when the plasma is de-energized.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Inventors: Bhaskar KUMAR, Prashanth KOTHNUR, Sidharth BHATIA, Anup Kumar SINGH, Vivek Bharat SHAH, Ganesh BALASUBRAMANIAN, Changgong WANG
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Publication number: 20200357668Abstract: Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.Type: ApplicationFiled: July 28, 2020Publication date: November 12, 2020Inventors: Sidharth BHATIA, Edward P. HAMMOND, IV, Bhaskar KUMAR, Anup Kumar SINGH, Vivek Bharat SHAH, Ganesh BALASUBRAMANIAN