Patents by Inventor Sidney Shen Kuang Chou

Sidney Shen Kuang Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9933589
    Abstract: A lens assembly includes a lens holder and a lens barrel that are coaxial and integrated in a unity, a cavity is defined therein to receive at least one lens, at least three guiding legs are extended from a bottom of the lens holder, and the guiding legs define a plane that is parallel to an installation plane of the lens. It can achieve an accurate optical axis alignment between the lens and the image sensor, reduce total assembly tolerances of the camera module thereby improving imaging quality, and reduce manufacturing cost to benefit the popularization in industries.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: April 3, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Chi Wai Lo, Sidney Shen Kuang Chou, Yiu Sing Ho, Fen Yan Li, Xin Tao Lang, Gui Ming Wei
  • Publication number: 20180024307
    Abstract: A lens assembly includes a lens holder and a lens barrel that are coaxial and integrated in a unity, a cavity is defined therein to receive at least one lens, at least three guiding legs are extended from a bottom of the lens holder, and the guiding legs define a plane that is parallel to an installation plane of the lens. It can achieve an accurate optical axis alignment between the lens and the image sensor, reduce total assembly tolerances of the camera module thereby improving imaging quality, and reduce manufacturing cost to benefit the popularization in industries.
    Type: Application
    Filed: August 16, 2016
    Publication date: January 25, 2018
    Inventors: Chi Wai LO, Sidney Shen Kuang CHOU, Yiu Sing HO, Fen Yan LI, Xin Tao LANG, Gui Ming WEI
  • Patent number: 9841609
    Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 12, 2017
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Sidney Shen Kuang Chou, Yiu Sing Ho, Kam Fung Yip, Jian Feng He
  • Publication number: 20170351112
    Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
    Type: Application
    Filed: June 28, 2016
    Publication date: December 7, 2017
    Inventors: Sidney Shen Kuang CHOU, Yiu Sing HO, Kam Fung YIP, Jian Feng HE
  • Publication number: 20150015990
    Abstract: A head stack assembly includes at least one head gimbal assembly and a flexible printed circuit assembly. A flexure tail of the head gimbal assembly includes a row of first bonding pads, a first dual stage actuator pad and a first dummy pad arranged at two sides of said row of first bonding pads, and the first dual stage actuator pad and the first dummy pad are connected together via a jumping lead. The flexible printed circuit assembly includes at least one row of second bonding pads, at least one second dual stage actuator pad and at least one second dummy pad arranged for connecting with the row of first bonding pads, the first dual stage actuator pad and the first dummy pad respectively. The connection way between the head gimbal assembly and the flexible printed circuit assembly is simple, thereby less cross talk is generated on the preamplifier.
    Type: Application
    Filed: September 10, 2013
    Publication date: January 15, 2015
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Sidney Shen Kuang Chou, Jackie Ka Yip Wong, Shu Deng, Xin Zhong, Lu Xiao