Patents by Inventor Siew Neo

Siew Neo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for face-up substrate polishing
    Publication number: 20030114087
    Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and at least partially circumscribes the substrate supporting surface. The polishing head is supported above the basin and includes a conductive polishing pad. Embodiments may further include a vent to allow gas to escape through the polishing head. Embodiments may further include an electrolyte supply that flows electrolyte into the polishing head and out through a permeable electrode and the conductive pad to the substrate. Embodiments may also be configured with a polishing head diameter smaller than the substrate supported by the carrier.
    Type: Application
    Filed: June 4, 2002
    Publication date: June 19, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Alain Duboust, Shou-Sung Chang, Liang-Yuh Chen, Yan Wang, Siew Neo, Lizhong Sun, Feng Q. Liu