Abstract: A USB device including a housing and a protective cap that are slidably and/or pivotably connected together such that the protective cap is able to slide and/or pivot between an open position, in which a plug connector extending from the front of the housing is exposed for operable coupling to a host system, and a closed position, in which the protective cap is disposed over the front end portion of the housing to protect the plug connector. A pivoting/sliding mechanism is provided on the housing and cap that secures the protective cap to the housing at all times, including during transitional movements of the protective cap between the opened and closed positions.

Abstract: A cryogenic grinding mill for grinding organic base material pieces into sub-micron-sized powder particles. An upper grinding block is rotated relative to a stationary lower grinding block by a motor, and is maintained at a temperature below ?150° C. by a cryogenic system including an annular liquid nitrogen chamber disposed around the grinding blocks. The upper grinding block defines a trench for receiving base material pieces fed by a feed system, and includes through-holes that extend from the trench to a grinding region formed between the grinding surfaces of the upper and lower blocks. When the upper grinding block is rotated, the base material pieces are gravity-fed from the trench to the grinding region, and ground powder material is forced to a peripheral edge of the grinding region. The powder material is then filtered, and particles having an undesirably large size are fed back into the trench for re-grinding.

Abstract: ESD protection for a portable electronic device is provided by sandwiching a metal ground layer between prepreg (i.e., FR4 or other non-conductive PCB material) layers to form an ESD preventive PCB structure, where the metal ground layer is electrically connected to one or more of the integrated circuit (IC) components (e.g., at least one controller die, a non-volatile memory die, oscillator and passive components) that are mounted on the PCB by way of conductive via structures, and is accessible by way of one or more conductive anchor hole structures to external grounding structures. The one or more conductive anchor hole structures are positioned such that the metal ground layer is automatically electrically connected to the chassis ground of a host system when the portable device is coupled to a plug structure of the host system, e.g., by way of a metal connector jacket.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.

Abstract: The present invention discloses UV-epoxy and ultrasonic case assembly methods for a USB flash drive, wherein a transparent or translucent top cover is fastened to a bottom cover containing a printed circuit board assembly via an UV-cure epoxy glue or an ultrasonic weld method. As the top cover of the USB flash drive is transparent or translucent, the USB flash drive has a see-through property and presents an aesthetic taste, which can attract the attention of consumers. Further, the method of the present invention uses less case parts and fewer steps and thus can fabricate a USB flash drive having a lower cost and a better quality at a higher throughput. Furthermore, the USB flash drive fabricated according to the method of the present invention has a better moisture resistance and a better water resistance.

Abstract: A method of testing memory modules comprising jumping through all addressable memory blocks a first and second time is disclosed. Each jumped-to address is determined by first XORing the last two bits of the previous address, and then XORing the first result with a bit representation of the previous jump direction for a second result. The second result determines the direction of the next jump, either upwards or downwards. Each jumped-to address is XORed with its contents, and the result is written to the address. For initially empty and defect-free memory, this results in all 1 values written for the first time jumping, and all 0 values written for the second time jumping. Finally, after the second time jumping, all addressable memory values are checked, and any non-0 value addresses are identified as defective memory cells.

Abstract: A solid state drive (SSD) device includes a printed-circuit board assembly (PCBA), a connector mounted on the circuit board, an open-frame support-type housing including first and second parallel elongated brackets extending along opposing peripheral edges of said circuit board, each bracket including a first connecting structure for securing the circuit board to the housing, and a second connecting structure for connecting the housing to an internal rack frame of a host system. The open-frame support type housing does not include a top cover and a bottom cover, whereby both of said opposing first and second surfaces are exposed by first and second openings. The housing includes optional end rails that form a box-like frame. The elongated brackets are formed using die-cast metal, stamped metal, or molded plastic with copper posts. Optional clamp-type brackets clamp along side edges of the PCBA.

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract: The present invention discloses a solid state drive with a coverless casing, which comprises: a printed circuit board assembly and a coverless casing. In the resent invention, the coverless casing is free of a top cover; thereby, air circulation can be enhanced to cool down the electronic components on a printed circuit board assembly more efficiently. Further, in the present invention, the coverless casing is designed to have the printed circuit board assembly electrically connected to the chassis ground of the host system via the coverless casings; thereby, unwanted electrostatic charges can be dissipated to the chassis ground of the host system before it can damage the electronic components on the printed circuit board assembly; thus, the ESD resistance thereof is promoted.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.

Abstract: A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. In one embodiment the metal contacts are formed on the same side as the thin plastic layer, and in an alternate embodiment the metal contacts are formed on a block that is mounted on the PCB during the SMT process.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

Abstract: A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.

Abstract: A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.

Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.

Abstract: A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.

Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.