Abstract: A Universal Serial Bus (USB) memory card includes a tube metal housing that is rectangularly-shaped and a Chip-On-Board (COB)-Universal Serial Bus (USB) device and a carrier substrate having a U-block disposed on one side of thereof and vertically extending upwardly from a bottom surface of the U-block, the COB-USB device positioned on the carrier substrate forming a USB card sub-assembly, the USB card sub-assembly being securely located inside the metal housing with the U-block serving to stop the COB-USB device from slipping out of the metal housing.

Abstract: High integration of a non-volatile memory device (NVMD) is disclosed. According to one aspect of the present invention, a non-volatile memory device comprises an intelligent non-volatile memory (NVM) controller and an intelligent non-volatile memory module. The NVM controller includes a central processing unit (CPU) configured to handle data transfer operations to the NVM module to ensure source synchronous interface, interleaved data operations and block abstracted addressing. The intelligent NVM module includes an interface logic, a block address manager and at least one non-volatile memory array. The interface logic is configured to handle physical block management. The block address manager is configured to ensure a physical address is converted to a transformed address that is accessible to the CPU of the intelligent NVM controller. The transformed address may be an address in blocks, pages, sectors or bytes either logically or physically.

Abstract: In an embodiment of the present invention, a memory card includes a bottom plastic piece having a plurality of lateral sides, one of which includes a notch, and a cavity interposed along the lateral sides. A printed circuit board (PCB) assembly, including memory, is positioned in the cavity. A fin-structure is created as part of the manufacturing process of the bottom plastic piece of the card. The memory card is configured to function in a read-write mode when the fin-structure is present, and in a write-protect mode when the fins are snapped off, and the notch is exposed. Alternatively, a plug device can be insertably positioned into the notch, causing the memory card to function in a read-write mode when the plug device is positioned into the notch, and in a write-protect mode when the plug device is removed and the notch is exposed.

Abstract: A secured digital (SD) card including a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The SD card further having a top cover and a printed circuit board (PCB) assembly positioned in said cavity, said top cover for covering said PCB assembly inside said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch, said SD card further having a male guide insertably positioned inside said notch, said SD card further having a female switch clamped onto said male guide to form a write-protect switch.

Abstract: Systems and methods of manufacturing and testing non-volatile memory (NVM) devices are described. According to one exemplary embodiment, a function test during manufacturing of the NVM modules is conducted with a system comprises a computer and a NVM tester coupling to the computer via an external bus. The NVM tester comprises a plurality of slots. Each of the slots is configured to accommodate respective one of the NVM modules to be tested. The NVM tester is configured to include an input/output interface, a microcontroller with associated RAM and ROM, a data generator, an address generator, a comparator, a comparison status storage space, a test result indicator and a NVM module detector. The data generator generates a repeatable sequence of data bits as a test vector. The known test vector is written to NVM of the NVM module under test. The known test vector is then compared with the data retrieved from the NVM module.

Abstract: A molded secured digital (SD) card having a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The molded SD card further having a printed circuit board (PCB) assembly positioned in said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch recess, said molded SD card further having a male guide insertably positioned into said notch recess, said molded SD card further having a female switch clamped onto said male guide to form a write-protect switch.

Abstract: Embodiments of a plug and cap of a Universal-Serial-Bus (USB) device have been presented. In one embodiment, a USB device includes a main body, a piece of string, and a cap. The main body has a printed circuit board assembly (PCBA) and a casing, wherein the PCBA is partially housed in the casing, and the PCBA further includes a USB connector protruding out of the casing at a first end of the casing. The piece of string is coupled to the main body and the cap. The cap is detachably coupled to the first end of the casing of the main body to cover the USB connector, wherein the cap remains indirectly coupled to the casing via the piece of string when the cap is detached from the first end of the casing to expose the USB connector.

Abstract: Thin solid state drive (SSD) housing structures are described. According to one embodiment of the invention, a structure for housing an SSD includes a pair of brackets configured to support a PCBA of the SSD at either side of the PCBA via one or more ledges with corresponding fastener holes pre-configured thereon. The ledges are attached to inside surface of the brackets. Each of the brackets has a slab shape with a length and a height. The length is parallel to horizontal direction, while the height parallel to vertical. The ledges are located at mid-height and orientated substantially perpendicular to the brackets such that the PCBA is supported horizontally. In order to securely connect the PCBA with the brackets, a plurality of metal fasteners is used. The fasteners are placed through the fastener holes on the ledges and through corresponding alignment holes pre-configured on the PCBA.

Abstract: High integration of a non-volatile memory device (NVMD) is disclosed. According to one aspect of the present invention, a non-volatile memory device comprises an intelligent non-volatile memory (NVM) controller and an intelligent non-volatile memory module. The NVM controller includes a central processing unit (CPU) configured to handle data transfer operations to the NVM module to ensure source synchronous interface, interleaved data operations and block abstracted addressing. The intelligent NVM module includes an interface logic, a block address manager and at least one non-volatile memory array. The interface logic is configured to handle physical block management. The block address manager is configured to ensure a physical address is converted to a transformed address that is accessible to the CPU of the intelligent NVM controller. The transformed address may be an address in blocks, pages, sectors or bytes either logically or physically.

Abstract: Systems and methods of manufacturing and testing non-volatile memory (NVM) devices are described. According to one exemplary embodiment, a function test during manufacturing of the NVM modules is conducted with a system comprises a computer and a NVM tester coupling to the computer via an external bus. The NVM tester comprises a plurality of slots. Each of the slots is configured to accommodate respective one of the NVM modules to be tested. The NVM tester is configured to include an input/output interface, a microcontroller with associated RAM and ROM, a data generator, an address generator, a comparator, a comparison status storage space, a test result indicator and a NVM module detector. The data generator generates a repeatable sequence of data bits as a test vector. The known test vector is written to NVM of the NVM module under test. The known test vector is then compared with the data retrieved from the NVM module.

Abstract: In an embodiment of the present invention, a single-sided memory card includes a single-sided memory card includes an injection- or transfer-molded base including the cavity, a thermal adhesive glue sheet position in the cavity, a PCBA secured inside the cavity of the single-sided memory card through the thermal adhesive glue sheet, and an adhesive label position on top of the PCBA, causing the PCBA to be protected and, after heating, the adhesive is cured binding the injection- or transfer-molded base.

Abstract: Thin solid state drive (SSD) housing structures are described. According to one embodiment of the invention, a structure for housing an SSD includes a pair of brackets configured to support a PCBA of the SSD at either side of the PCBA via one or more ledges with corresponding fastener holes pre-configured thereon. The ledges are attached to inside surface of the brackets. Each of the brackets has a slab shape with a length and a height. The length is parallel to horizontal direction, while the height parallel to vertical. The ledges are located at mid-height and oriented substantially perpendicular to the brackets such that the PCBA is supported horizontally. In order to securely connect the PCBA with the brackets, a plurality of metal fasteners is used. The fasteners are placed through the fastener holes on the ledges and through corresponding alignment holes pre-configured on the PCBA.

Abstract: Portable electronic storage device (PESD) manufacturing methods utilizing lead frames are described. According to one exemplary embodiment, a process of manufacturing core unit of PESD comprises: producing a processed flash memory IC chip with several metal contact pads and at least one passive component located on top layer; pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity through both surfaces; attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component; and forming a molded enclosure on both surfaces of the lead frame to form a core unit, the mold enclosure is configured such that the connectors are exposed according to one of the PESD standards.