Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: A probe card for detecting a wafer. The probe card includes a light-output element, which is connected to a positioning element. The light-output element is set within a through hole of an electrical detection substrate. The light-output element is connected to a light source controller by an optical fiber, thereby an output light can be transmitted from the light source controller to the light-output element. The positioning element can move the light-output element in three-dimensional space or adjust an emitting angle from an axis of the light-output element. Therefore, an optical measurement and an electrical measurement can be implemented at the same time in the silicon photonic wafer test.