Patents by Inventor Silvio Grespan
Silvio Grespan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240069265Abstract: A multilayer polymer thin film includes an anti-reflective coating directly overlying a reflective polarizer stack. The reflective polarizer stack includes alternating first and second polymer layers, where the first layers include an isotropic polymer thin film and the second layers include an anisotropic polymer thin film. The anti-reflective coating (ARC) includes alternating third and fourth layers, where the third layers include an isotropic polymer thin film or an anisotropic polymer thin film and the fourth layers include an isotropic polymer thin film. The multilayer polymer thin film may be formed by co-extrusion where the reflective polarizer stack and the anti-reflective coating are formed simultaneously.Type: ApplicationFiled: December 6, 2022Publication date: February 29, 2024Inventors: Weihua Gao, Sheng Ye, Silvio Grespan, Aiqing Chen, Rongzhi Huang, Christopher Yuan Ting Liao, Andrew John Ouderkirk, Zhaoyu Nie, Liliana Ruiz Diaz
-
Patent number: 11703709Abstract: An optical element includes a linear polarizer layer and a transparent optical layer. The linear polarizer layer includes surfaces waviness and the transparent optical layer smooths the surfaces waves of the linear polarizer layer.Type: GrantFiled: February 2, 2021Date of Patent: July 18, 2023Assignee: Meta Platforms Technologies, LLCInventors: Jianing Yao, Daozhi Wang, Silvio Grespan, Weihua Gao, Chia-Hsuan Tai, Shizhe Shen, John Robert Volk, Richard Han Soo Cho
-
Patent number: 11247422Abstract: A computer-implemented method for optical element fabrication with optical scanner feedback includes initiating the optical scanner to obtain an optical measurement of an optical layer of a multi-layer film. A rotational orientation for an optical element that is to be cut from the multi-layer film is then determined based on the optical measurement. The method also includes initiating a cutting instrument to cut the optical element from the multi-layer film at the rotational orientation.Type: GrantFiled: August 28, 2019Date of Patent: February 15, 2022Assignee: Facebook Technologies, LLCInventors: Silvio Grespan, Aiqing Chen
-
Publication number: 20210132384Abstract: A near-eye optical element includes light sources arranged with an illumination layer. The light sources are angled to direct light from the light sources to illuminate an ocular region.Type: ApplicationFiled: March 20, 2020Publication date: May 6, 2021Inventors: Christopher Yuan-Ting Liao, Qi Zhang, Kurt Allen Jenkins, Karol Constantine Hatzilias, Robin Sharma, Alexander Sohn, Silvio Grespan, Gangok Lee
-
Publication number: 20200122417Abstract: A computer-implemented method for optical element fabrication with optical scanner feedback includes initiating the optical scanner to obtain an optical measurement of an optical layer of a multi-layer film. A rotational orientation for an optical element that is to be cut from the multi-layer film is then determined based on the optical measurement. The method also includes initiating a cutting instrument to cut the optical element from the multi-layer film at the rotational orientation.Type: ApplicationFiled: August 28, 2019Publication date: April 23, 2020Inventors: Silvio Grespan, Aiqing Chen
-
Patent number: 9504124Abstract: An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing conductive structures that pass through polymer layers of the display and/or conductive structures that wrap around an edge of the display and couple conductive traces on the display to conductive traces on additional circuitry that is mounted behind the display.Type: GrantFiled: July 18, 2013Date of Patent: November 22, 2016Assignee: Apple Inc.Inventors: Sang Ha Kim, Silvio Grespan, John Z. Zhong, Jean-Pierre Guillou, Kuo-Hua Sung, Paul S. Drzaic, Young Bae Park, Vasudha Gupta
-
Patent number: 9494178Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.Type: GrantFiled: February 18, 2014Date of Patent: November 15, 2016Assignee: Apple Inc.Inventors: Cyrus Y. Liu, Kuo-Hua Sung, Po-Jui Chen, Silvio Grespan
-
Patent number: 9489019Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.Type: GrantFiled: June 2, 2014Date of Patent: November 8, 2016Assignee: Apple Inc.Inventors: Miguel C. Christophy, Silvio Grespan, Richard Hung Minh Dinh, John O. Ceideburg, Kingsuk Brahma
-
Patent number: 9419065Abstract: An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.Type: GrantFiled: July 1, 2013Date of Patent: August 16, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, Chieh-Wei Chen, Dinesh C. Mathew, Paul S. Drzaic, Sang Ha Kim, Silvio Grespan, John Z. Zhong, Jean-Pierre Guillou, Kuo-Hua Sung, Young Bae Park, Vasudha Gupta
-
Patent number: 9409383Abstract: Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.Type: GrantFiled: March 20, 2009Date of Patent: August 9, 2016Assignee: APPLE INC.Inventors: Casey J. Feinstein, Silvio Grespan, Kuo-Hua Sung, John Z. Zhong, Lynn Youngs
-
Patent number: 9374898Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.Type: GrantFiled: April 24, 2013Date of Patent: June 21, 2016Assignee: Apple Inc.Inventors: Kuo-Hua Sung, Silvio Grespan
-
Patent number: 9351400Abstract: Conductive contacts can be disposed on multiple substrates or on different surfaces of a single substrate. Conductive material is disposed over at least a portion of the two conductive contacts to electrically connect the contacts. The conductive material may be disposed over at least one surface between the conductive contacts. One or more conductive borders can be formed on a surface of a conductive layer. The conductive border or borders can improve signal transmission across the surface of the conductive layer.Type: GrantFiled: February 20, 2014Date of Patent: May 24, 2016Assignee: Apple Inc.Inventors: Kuo-Hua Sung, Silvio Grespan, Brian Shadle, Romain A. Teil, Michael B. Wittenberg
-
Patent number: 9302457Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.Type: GrantFiled: February 13, 2013Date of Patent: April 5, 2016Assignee: Apple Inc.Inventors: Silvio Grespan, Shih-Min Hsu, Heng-Hsi Wu, Kuo-Hua Sung, Cyrus Y. Liu
-
Patent number: 9213451Abstract: Improved techniques are disclosed for fabrication of touch panels using thin sheet glass, coupling external circuitry, and securely holding the touch panel within a portable electronic device. The thin sheet glass may be chemically strengthened and laser scribed.Type: GrantFiled: September 30, 2010Date of Patent: December 15, 2015Assignee: Apple Inc.Inventors: Silvio Grespan, Casey Feinstein, Kuo-Hua Sung, John Z. Zhong
-
Patent number: 9101083Abstract: A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.Type: GrantFiled: September 10, 2012Date of Patent: August 4, 2015Assignee: APPLE INC.Inventors: Silvio Grespan, Shih-Min Hsu, Heng-Hsi Wu, Kuo-Hua Sung
-
Publication number: 20150070622Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.Type: ApplicationFiled: June 2, 2014Publication date: March 12, 2015Applicant: Apple Inc.Inventors: Miguel C. CHRISTOPHY, Silvio GRESPAN, Richard Hung Minh DINH, John O. CEIDEBURG, Kingsuk BRAHMA
-
Publication number: 20140321075Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.Type: ApplicationFiled: April 24, 2013Publication date: October 30, 2014Applicant: Apple Inc.Inventors: Kuo-Hua SUNG, Silvio GRESPAN
-
Patent number: 8830695Abstract: An electronic device includes a substrate (1), an electronic component (2) seated on the substrate (1), and a cover (3) across the electronic component (2) with a space (330) between the cover (3) and the electronic component (2). The cover (3) is configured on an inside (32) facing the electronic component (2) in such fashion that the cover (3) has at least one support structure (4, 40) protruding into the space (330).Type: GrantFiled: June 20, 2007Date of Patent: September 9, 2014Assignee: Osram Opto Semiconductors GmbHInventor: Silvio Grespan
-
Publication number: 20140246148Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.Type: ApplicationFiled: February 18, 2014Publication date: September 4, 2014Applicant: Apple Inc.Inventors: Cyrus Y. Liu, Kuo-Hua Sung, Po-Jui Chen, Silvio Grespan
-
Patent number: 8808483Abstract: A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 ?m in thickness, and can be reduced to a desired thickness below 200 ?m after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.Type: GrantFiled: November 5, 2010Date of Patent: August 19, 2014Assignee: Apple Inc.Inventors: Kuo-Hua Sung, Casey J. Feinstein, Silvio Grespan