Patents by Inventor Silvio REIFF

Silvio REIFF has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for applying solder to a work piece
    Patent number: 8777087
    Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 15, 2014
    Assignee: Schott Solar AG
    Inventors: Hilmar Von Campe, Stefan Meyer, Thai Huynh-Minh, Stephan Huber, Silvio Reiff
  • METHOD AND APPARATUS FOR APPLYING SOLDER TO A WORK PIECE
    Publication number: 20140158749
    Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 12, 2014
    Inventors: Hilmar VON CAMPE, Stefan MEYER, Thai HUYNH-MINH, Stephan HUBER, Silvio REIFF
  • METHOD AND APPARATUS FOR APPLYING SOLDER TO A WORK PIECE
    Publication number: 20110204126
    Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.
    Type: Application
    Filed: February 23, 2011
    Publication date: August 25, 2011
    Applicant: SCHOTT SOLAR AG
    Inventors: Hilmar VON CAMPE, Stefan MEYER, Thai HUYNH-MINH, Stephan HUBER, Silvio REIFF