Abstract: Benzoylamides of the general formula (I) are described as herbicides. In this formula (I), B, X1 and X2 represent N, O or S(O)n. R, Ra, Rb and Rx represent radicals such as hydrogen, halogen, (C1-C6)-alkyl, halo-(C1-C6)-alkyl, (C1-C6)-alkyloxy and cyano.

Abstract: The instant disclosure generally relates to a multicomponent composition for coating mammalian or synthetic keratin material and textiles, the composition comprising a first and second components and a third component. The first and second components comprise first and second compounds respectively. Any one or more of the first, second and third components may also comprise pigment microparticles. The first, second and third compounds meld together on keratin material and textiles and especially on hair to form a coating that can be formulated to provide temporary coverage or provide permanent coverage. The multicomponent composition formed and set in situ as a solid linked coating ranges from ready removability to substantially permanent lastingness.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: In order to enable high image acquisition rate with simultaneous low energy consumption of a camera 1, a camera (1), in particular a 3D time-of-flight camera, is provided, comprising an illumination unit (2) which emits light pulses during an illumination phase (Bp), an image sensor (3) which generates images from the light pulses reflected by an object, a switching controller (4) which controls current to the illumination unit (2), the switching controller (4) being operable in a continuous and a discontinuous mode (CCM; DCM), and a control unit (5) which is designed to activate and deactivate the continuous mode (CCM) of the switching controller (4) as a function of the illumination phase (Bp) of the illumination unit (2).

Abstract: A method is provided for dicing a semiconductor substrate into a plurality of dies, the semiconductor substrate having a front side including a plurality of device areas, a back side, and a plurality of through substrate vias. The method includes defining, from the front side, at least one trench to be formed between adjacent device areas, forming the at least one trench, from the front side of the semiconductor substrate, arranging a protective layer on the front side of the semiconductor substrate, thinning the semiconductor substrate from the back side to reduce the thickness of the semiconductor substrate, processing the back side of the semiconductor substrate to form at least one contact, the contact contacting at least one through substrate via, etching through the minor portion of the thickness of the semiconductor substrate underneath the at least one trench, and dicing the semiconductor substrate into the plurality of dies.

Abstract: A sealing profile receiving device having first and second holding units for receiving and holding first and second sealing profile elements, and a casting unit for casting a connecting portion for connecting the first and second sealing profile elements and/or for casting first and second end terminations of the first and second sealing profile elements. A first and/or second and/or third drive unit for driving at least one holding and/or clamping and/or ejector element is/are provided and includes a chain comprising a plurality of chain links arranged at least between two guide faces of a guide unit for guiding the chain and/or chain links, such that an adjusting force can be exerted in the pulling and pushing directions of the chain by the first and/or second and/or third drive unit.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: A method is provided for dicing a semiconductor substrate into a plurality of dies, the semiconductor substrate having a front side including a plurality of device areas, a back side, and a plurality of through substrate vias. The method includes defining, from the front side, at least one trench to be formed between adjacent device areas, forming the at least one trench, from the front side of the semiconductor substrate, arranging a protective layer on the front side of the semiconductor substrate, thinning the semiconductor substrate from the back side to reduce the thickness of the semiconductor substrate, processing the back side of the semiconductor substrate to form at least one contact, the contact contacting at least one through substrate via, etching through the minor portion of the thickness of the semiconductor substrate underneath the at least one trench, and dicing the semiconductor substrate into the plurality of dies.

Abstract: A sealing profile receiving device having first and second holding units for receiving and holding first and second sealing profile elements, and a casting unit for casting a connecting portion for connecting the first and second sealing profile elements and/or for casting first and second end terminations of the first and second sealing profile elements. A first and/or second and/or third drive unit for driving at least one holding and/or clamping and/or ejector element is/are provided and includes a chain comprising a plurality of chain links arranged at least between two guide faces of a guide unit for guiding the chain and/or chain links, such that an adjusting force can be exerted in the pulling and pushing directions of the chain by the first and/or second and/or third drive unit.

Abstract: The present invention relates to the use of a composition comprising one or more ammonium salt(s) of one or more compounds selected from the group consisting of sulfobutanedioic acid diester(s), (sulfomethyl)-butanedioic acid diester(s), methyl-sulfobutanedioic acid diester(s), sulfoglutaric acid diester(s), and sulfotricarballic acid triester(s), for cleaning or rinsing a product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm and below. The invention also relates to a corresponding method of making a cleaned or rinsed product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm or below. The invention also relates to a solution with color of HAZEN number below 1000 and/or a turbidity in the range of from 0.08 to 10 NTU, wherein the solution comprises water and one or more ammonium salt(s) and optionally one or more organic solvent compounds.

Abstract: The present invention refers to a method for the separation of host cell proteins (HCPs), antibody fragments and low molecular weight substances from solutions containing antibodies.

Abstract: The present invention relates to the use of a composition comprising one or more ammonium salt(s) of one or more compounds selected from the group consisting of sulfobutanedioic acid diester(s), (sulfomethyl)-butanedioic acid diester(s), methyl-sulfobutanedioic acid diester(s), sulfoglutaric acid diester(s), and sulfotricarballic acid triester(s), for cleaning or rinsing a product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm and below. The invention also relates to a corresponding method of making a cleaned or rinsed product comprising a substrate and supported thereon a patterned material layer having line-space structures with a line width of 50 nm or below. The invention also relates to a solution with color of HAZEN number below 1000 and/or a turbidity in the range of from 0.08 to 10 NTU, wherein the solution comprises water and one or more ammonium salt(s) and optionally one or more organic solvent compounds.

Abstract: The present invention refers to a method for the separation of host cell proteins (HCPs), antibody fragments and low molecular weight substances from solutions containing antibodies.

Abstract: A photoresist stripping and cleaning composition free from N-alkylpyrrolidones and added quaternary ammonium hydroxides comprising a component (A) which comprises the polar organic solvents N-methylimidazole, dimethylsulfoxide and 1-aminopropane-2-ol.

Abstract: An aqueous alkaline etching and cleaning composition for treating the surface of silicon substrates, the said composition comprising: (A) a quaternary ammonium hydroxide; and (B) a component selected from the group consisting of water-soluble acids and their water-soluble salts of the general formulas (I) to (V): (R1—S03-)nXn+ (I), R—P032?(Xn+)3-n (II); (RO—S03-)nXn+ (III), RO—P032?(Xn+)3-n, (IV), and [(RO)2P02?]nXn+ (V); wherein the n=1 or 2; X is hydrogen or alkaline or alkaline-earth metal; the variable R1 is an olefinically unsaturated aliphatic or cycloaliphatic moiety and R is R1 or an alkylaryl moiety; the use of the composition for treating silicon substrates, a method for treating the surface of silicon substrates, and methods for manufacturing devices generating electricity upon the exposure to electromagnetic radiation.

Abstract: An aqueous acidic etching solution suitable for texturing the surface of single crystal and polycrystal silicon substrates and containing, based on the complete weight of the solution, 3 to 10% by weight of hydrofluoric acid; 10 to 35% by weight of nitric acid; 5 to 40% by weight of sulfuric acid; and 55 to 82% by weight of water; a method for texturing the surface of single crystal and polycrystal silicon substrates comprising the step of (1) contacting at least one major surface of a substrate with the said aqueous acidic etching solution; (2) etching the at least one major surface of the substrate for a time and at a temperature sufficient to obtain a surface texture consisting of recesses and protrusions; and (3) removing the at least one major surface of the substrate from the contact with the aqueous acidic etching solution; and a method for manufacturing photovoltaic cells and solar cells using the said solution and the said texturing method.

Abstract: A photoresist stripping and cleaning composition free from N-alkylpyrrolidones and added quaternary ammonium hydroxides comprising a component (A) which comprises the polar organic solvents N-methylimidazole, dimethylsulfoxide and 1-aminopropane-2-ol.

Abstract: An aqueous acidic solution and an aqueous acidic etching solution suitable for texturizing the surface of single crystal and polycrystal silicon substrates, hydrofluoric acid; nitric acid; and at least one anionic polyether, which is surface active; a method for texturizing the surface of single crystal and polycrystal silicon substrates comprising the step of (1) contacting at least one major surface of a substrate with the said aqueous acidic etching solution; (2) etching the at least one major surface of the substrate for a time and at a temperature sufficient to obtain a surface texturization consisting of recesses and protrusions; and (3) removing the at least one major surface of the substrate from the contact with the aqueous acidic etching solution; and a method for manufacturing photovoltaic cells and solar cells using the said solution and the said texturizing method.

Abstract: A fastening arrangement for fastening a component, in particular a supply line, of an aircraft or spacecraft. The fastening arrangement includes a structural element of the aircraft or spacecraft; an adhesive retainer, which comprises a flexible connection portion having an adhesive surface for placing onto the structural element and a retaining portion, operatively connected to the connection portion, for receiving the component, at least in portions; and an adhesive material, which is arranged between the adhesive surface and the structural element. Also provided is an adhesive retainer of a fastening arrangement of this type, and an aircraft or spacecraft having a fastening arrangement of this type and/or an adhesive retainer of this type.

Abstract: An aqueous acidic solution and an aqueous acidic etching solution suitable for texturizing the surface of single crystal and polycrystal silicon substrates, hydrofluoric acid; nitric acid; and at least one anionic polyether, which is surface active; a method for texturizing the surface of single crystal and polycrystal silicon substrates comprising the step of (1) contacting at least one major surface of a substrate with the said aqueous acidic etching solution; (2) etching the at least one major surface of the substrate for a time and at a temperature sufficient to obtain a surface texturization consisting of recesses and protrusions; and (3) removing the at least one major surface of the substrate from the contact with the aqueous acidic etching solution; and a method for manufacturing photovoltaic cells and solar cells using the said solution and the said texturizing method.