Patents by Inventor Simon HOUIS
Simon HOUIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151749Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Inventors: Lucian BARBUT, Francis MONCHAL, Simon HOUIS, Lionel TOMBEZ
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Patent number: 11927606Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.Type: GrantFiled: November 29, 2022Date of Patent: March 12, 2024Assignee: MELEXIS TECHNOLOGIES SAInventors: Lucian Barbut, Francis Monchal, Simon Houis, Lionel Tombez
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Publication number: 20240036084Abstract: A current sensor system for accurately measuring an AC electrical current having frequencies up to 2 kHz, the system comprising: an electrical conductor (e.g. busbar) for conducting said AC current thereby creating a first magnetic field; a magnetic sensor device for measuring a magnetic field component or gradient; an object (e.g. a metal plate) having an electrically conductive surface arranged in the vicinity of said conductor for allowing eddy currents to flow in said surface, thereby creating a second magnetic field which is superimposed with the first magnetic field; wherein the magnetic sensor device is configured for determining the current as a signal or value proportional to the measured component or gradient. The metal plate may have an opening. The current sensor system may further comprise a shielding.Type: ApplicationFiled: October 9, 2023Publication date: February 1, 2024Inventor: Simon HOUIS
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Publication number: 20240003940Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: ApplicationFiled: September 15, 2023Publication date: January 4, 2024Inventors: Lucian BARBUT, Simon HOUIS, Lionel TOMBEZ, Tim VANGERVEN
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Patent number: 11815533Abstract: A current sensor system for accurately measuring an AC electrical current having frequencies up to 2 kHz, the system comprising: an electrical conductor (e.g. busbar) for conducting said AC current thereby creating a first magnetic field; a magnetic sensor device for measuring a magnetic field component or gradient; an object (e.g. a metal plate) having an electrically conductive surface arranged in the vicinity of said conductor for allowing eddy currents to flow in said surface, thereby creating a second magnetic field which is superimposed with the first magnetic field; wherein the magnetic sensor device is configured for determining the current as a signal or value proportional to the measured component or gradient. The metal plate may have an opening. The current sensor system may further comprise a shielding.Type: GrantFiled: September 20, 2021Date of Patent: November 14, 2023Assignee: MELEXIS TECHNOLOGIES SAInventor: Simon Houis
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Publication number: 20230358789Abstract: A current sensor arrangement for measuring an AC electrical current, comprising: an electrical conductor having three transverse rectangular cut-outs; a sensor device comprising two sensor elements spaced apart along a first direction for measuring two magnetic field components oriented in said first direction, and configured for determining a magnetic field difference or magnetic field gradient, and for determining the AC current based on said difference or gradient. The sensor device is positioned at a particular location relative to the second cut-out, such that the magnetic field difference or gradient is substantially proportional to the AC current for frequencies from 100 Hz to 2 kHz. A current sensor system. A method of measuring an AC current with improved accuracy.Type: ApplicationFiled: July 17, 2023Publication date: November 9, 2023Inventor: Simon HOUIS
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Patent number: 11796572Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: GrantFiled: October 29, 2021Date of Patent: October 24, 2023Assignee: MELEXIS TECHNOLOGIES SAInventors: Lucian Barbut, Simon Houis, Lionel Tombez, Tim Vangerven
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Patent number: 11796573Abstract: A current sensor system for measuring an AC electrical current, includes: a busbar having a beam shaped portion having a length and a width; a sensor device comprising two sensor elements spaced apart from each other in the width direction of the beam shaped portion. The sensor device is configured for measuring a magnetic field difference or a magnetic field gradient, and for determining the AC current based on said difference or gradient.Type: GrantFiled: April 1, 2022Date of Patent: October 24, 2023Assignee: MELEXIS TECHNOLOGIES SAInventor: Simon Houis
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Patent number: 11747369Abstract: A current sensor arrangement for measuring an AC electrical current, comprising: an electrical conductor having three transverse rectangular cut-outs; a sensor device comprising two sensor elements spaced apart along a first direction for measuring two magnetic field components oriented in said first direction, and configured for determining a magnetic field difference or magnetic field gradient, and for determining the AC current based on said difference or gradient. The sensor device is positioned at a particular location relative to the second cut-out, such that the magnetic field difference or gradient is substantially proportional to the AC current for frequencies from 100 Hz to 2 kHz. A current sensor system. A method of measuring an AC current with improved accuracy.Type: GrantFiled: July 9, 2021Date of Patent: September 5, 2023Assignee: MELEXIS TECHNOLOGIES SAInventor: Simon Houis
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Patent number: 11740263Abstract: A current sensor system for measuring an AC electrical current, comprising: a busbar having a thickness and a width; a sensor device comprising two sensor elements spaced apart along a first direction for measuring two magnetic field components oriented in a second direction; the sensor device configured for determining a magnetic field difference, and for determining the AC current based on said difference. The sensor device is positioned relative to the busbar such that a reference point in the middle between the two sensor elements is located at a first distance from a side of the busbar from 70% to 110% or from 70% to 95% of the width of the busbar and is located at a second distance from 0.5 to 4.0 mm from the busbar.Type: GrantFiled: May 26, 2021Date of Patent: August 29, 2023Assignee: MELEXIS TECHNOLOGIES SAInventor: Simon Houis
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Publication number: 20230204632Abstract: A sensing system is provided for contactless sensing of current. The system includes a conductor for generating a magnetic field as electric current flows through the conductor, the conductor having a predetermined width and comprising a hole with a predetermined hole width passing through the whole thickness of the conductor, and a magnetic sensor for measuring at least one component of the magnetic field generated by the conductor. The magnetic sensor overlaps the hole. The current sensing is done based on the measured magnetic field. The sensor is positioned at a predetermined distance over a top surface of the conductor. The width of the hole is at least 0.15 times the width of the conductor.Type: ApplicationFiled: November 29, 2022Publication date: June 29, 2023Inventor: Simon HOUIS
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Publication number: 20230204636Abstract: The present invention relates to a current sensor device comprising: current sensing means for sensing a current, a circuit arranged to convert a signal received from the current sensing means into a signal indicative of the sensed current, storage means for storing a plurality of values of the signal indicative of the sensed current, a processing circuit arranged for receiving a subset of the plurality of values stored in the storage means, for detecting or predicting an event based on a function of the subset, said function being stored in the storage means, and for generating a corresponding event signal, said current supervisory device further comprising an interface circuit arranged to output the corresponding event signal.Type: ApplicationFiled: December 29, 2022Publication date: June 29, 2023Inventors: Bruno BOURY, Simon HOUIS, Stephane RAUW, Lionel TOMBEZ, Guido DUPONT, Adrian HILL
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Publication number: 20230086851Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Inventors: Lucian BARBUT, Francis MONCHAL, Simon HOUIS, Lionel TOMBEZ
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Publication number: 20230084942Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.Type: ApplicationFiled: September 21, 2022Publication date: March 16, 2023Inventors: Robert RACZ, Amalia SPATARU, Simon HOUIS, Bruno BOURY, Javier BILBAO DE MENDIZABAL
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Patent number: 11531046Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.Type: GrantFiled: September 24, 2021Date of Patent: December 20, 2022Assignee: MELEXIS TECHNOLOGIES SAInventors: Lucian Barbut, Francis Monchal, Simon Houis, Lionel Tombez
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Publication number: 20220341971Abstract: A current sensor system for measuring an AC electrical current, includes: a busbar having a beam shaped portion having a length and a width; a sensor device comprising two sensor elements spaced apart from each other in the width direction of the beam shaped portion. The sensor device is configured for measuring a magnetic field difference or a magnetic field gradient, and for determining the AC current based on said difference or gradient.Type: ApplicationFiled: April 1, 2022Publication date: October 27, 2022Inventor: Simon HOUIS
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Patent number: 11480590Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.Type: GrantFiled: January 7, 2019Date of Patent: October 25, 2022Assignee: MELEXIS TECHNOLOGIES SAInventors: Robert Racz, Amalia Spataru, Simon Houis, Bruno Boury, Javier Bilbao De Mendizabal
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Patent number: 11480591Abstract: A current-sensor structure comprises a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces and an edge. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction. The current sensor is aligned with the edge of the conductor or the conductor has a width W and the current sensor is within a distance of W/2.5, W/3, W/4, W/5 or W/6 of the conductor edge. The current-sensor structure can comprise a substrate on which the conductor is disposed.Type: GrantFiled: January 7, 2019Date of Patent: October 25, 2022Assignee: MELEXIS TECHNOLOGIES SAInventors: Javier Bilbao De Mendizabal, Simon Houis
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Publication number: 20220137100Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: ApplicationFiled: October 29, 2021Publication date: May 5, 2022Inventors: Lucian BARBUT, Simon HOUIS, Lionel TOMBEZ, Tim VANGERVEN
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Publication number: 20220099709Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.Type: ApplicationFiled: September 24, 2021Publication date: March 31, 2022Inventors: Lucian BARBUT, Francis MONCHAL, Simon HOUIS, Lionel TOMBEZ