Abstract: The present application is directed to a reservoir for use with a micro-electromechanical device having a first surface area to be lubricated. The reservoir comprises a solid component with a porous structure having a second surface area. The second surface area is greater than the first surface area. The reservoir also comprises a lubricant capable of reversibly reacting with either the solid component or the first surface area of the microelectromechanical device.

Abstract: A large-area optical element is described. The large-area optical element includes a monolithic container fabricated from a transparent material, wherein the monolithic container has a plurality of optical surfaces. A liquid is positioned within the monolithic container, wherein the liquid has a density substantially less than a density of the monolithic container.

Abstract: The present disclosure provides a method for manufacturing an interconnect in a semiconductor device, a method for manufacturing a digital micromirror device, a digital micromirror device and a method for manufacturing a projection display system. The method for manufacturing the digital micromirror device, without limitation, may include forming a first metal layer over a substrate and subjecting the first metal layer to an immersion deposition process, the immersion deposition process forming a passivating layer over the first metal layer. This method may also include forming a spacer layer over the first metal layer, the spacer layer having one or more openings therein, and forming a second metal layer over the spacer layer and in the one or more openings, the second metal layer contacting the passivating layer.

Abstract: A large-area optical element is described. The large-area optical element includes a monolithic container fabricated from a transparent material, wherein the monolithic container has a plurality of optical surfaces. A liquid is positioned within the monolithic container, wherein the liquid has a density substantially less than a density of the monolithic container.

Abstract: A zeolite and an organic binder are mixed with a solvent to form a paste (302). The paste is then cast or molded (304) into the desired shape. A portion of the solvent is allowed to evaporate from the paste, hardening the getter (306). Getters are often formed in sheets and cut (308) into individual pieces, called dibs, after the sheets have hardened. Even after the getter is hardened, significant amounts of solvent are retained by the getter. The getter is exposed to water vapor which displaces (310) the solvent from the getter. After the solvent is removed, the getter is dried (312) to remove additional water vapor. Because the water vapor does not bind as tightly to the zeolite getter, the water vapor is removed much easier than the solvent. The water may be removed by allowing the getter to dry naturally, or by a vacuum bake process.

Abstract: A zeolite and an organic binder are mixed with a solvent to form a paste (302). The paste is then cast or molded (304) into the desired shape. A portion of the solvent is allowed to evaporate from the paste, hardening the getter (306). Getters are often formed in sheets and cut (308) into individual pieces, called dibs, after the sheets have hardened. Even after the getter is hardened, significant amounts of solvent are retained by the getter. The getter is exposed to water vapor which displaces (310) the solvent from the getter. After the solvent is removed, the getter is dried (312) to remove additional water vapor. Because the water vapor does not bind as tightly to the zeolite getter, the water vapor is removed much easier than the solvent. The water may be removed by allowing the getter to dry naturally, or by a vacuum bake process.

Abstract: An optocoupler structure comprising a semiconductor chip having an integrated circuit and an optically transparent, electrically insulating layer having first and second surfaces; an organic diode integral with said first surface, said diode operable to emit electromagnetic radiation; and said circuit including a radiation-sensitive semiconductor device integral with said second surface, electrically isolated from said diode, and positioned in the path of said radiation.

Abstract: A method of photolithographically patterning an organic semiconductor device, comprising the steps of protecting the organic layer of the device by depositing a metal layer thereon, depositing and patterning a photoresist layer on said metal layer, and selectively etching the exposed areas to pattern said metal layer and said organic layer. Specifically, the disclosed method provides the photolithographic fabrication of organic light emitting diodes (OLEDs) and organic lasers diodes (OLDs).

Abstract: A solid-state relay is created by a power-switching device embedded in a semiconductor wafer which includes an optically transparent, electrically insulating surface, an organic light-emitting diode (OLED) formed on that surface, and a light-absorbing device integrated with the power-switching device, electrically isolated from the diode, and positioned in the path of the emitted light.

Abstract: An optocoupler structure comprising a semiconductor chip having an integrated circuit and an optically transparent, electrically insulating layer having first and second surfaces; an organic diode integral with said first surface, said diode operable to emit electromagnetic radiation; and said circuit including a radiation-sensitive semiconductor device integral with said second surface, electrically isolated from said diode, and positioned in the path of said radiation.

Abstract: An organic light emitting diode with dielectric barriers (120, 106) at both the anode-organic and the cathode-organic interfaces.