Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: An infrared proximity sensor includes a substrate, an emitting unit, a receiving unit, a packaging unit and an isolating unit. The substrate has a supporting surface and the supporting surface has an emitting region and a receiving region corresponding in position to the emitting region. The emitting unit is disposed on the emitting region. The receiving unit is disposed on the receiving region. The packaging unit includes a first package body and a second package body. The first package body covers the emitting unit and the second package body covers the receiving unit. The isolating unit is disposed between the first package body and the second package body. The substrate has a first side and a second side, and the first side has a length less than 1.5 mm.

Abstract: A manufacturing method of wafer level sensing module includes: providing a chip substrate formed with a first receptor and a second receptor; disposing an emitter on the chip substrate; disposing a shielding assembly on the top surface of the chip substrate; and disposing a transparent shielding plate on the top surface of the chip substrate and in positional correspondence with the second receptor. The first lens is connected between the first shielding member and the second shielding member, and the emitter is arranged in a first space defined by the first shielding member, the first lens, the second shielding member, and the chip substrate. The second lens is connected between the second shielding member and the third shielding member, and the first receptor is arranged in a second space defined by the second shielding member, the second lens, the third shielding member, and the chip substrate.

Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.

Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.

Abstract: A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.

Abstract: A detection device and a method of manufacturing the same are disclosed. The detection device includes a detection module and a housing module disposed on the detection module. The detection module includes a substrate, an emission unit, and a detection unit. The substrate includes an emission end area on which the emission unit is disposed, and a receiver end area on which the detection unit is disposed. The housing module includes a plastic housing unit having a receiving space and an opening, and a metallic shielding unit disposed on the plastic housing unit. The receiving space is divided into a first receiving space and a second receiving space by the metallic shielding unit, and the opening is divided into an emission hole and a detection hole by the metallic shielding unit. By the above-mentioned means, the distance between the emission hole and the detection hole is reduced.

Abstract: The instant disclosure relates to a method of manufacturing proximity sensor includes the steps of providing a substrate having emitters and detectors disposed thereon. A sensor area is defined by one emitter with the adjacent detector. Wire bonding the emitters and detectors to the substrate for electrical connection. Molding a plurality of housings corresponds to each of the sensor areas and encapsulates the emitters and detectors. A shield having a plurality of apertures is provided and disposed atop the housings. After injection molding, an isolation layer is formed between the shield and substrate. Singulation is followed by injection molding to separate each of the sensor areas.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

Abstract: An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.

Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.

Abstract: A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.

Abstract: A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.

Abstract: A bi-curvature lens for diodes in an infrared wireless communication transceiver is disclosed. Devices having such a bi-curvature lens, such as a light emitting device, a light detecting device, and a transceiver are also disclosed. A method for designing such a lens, and a method for fabricating a device having such a lens are also disclosed. The bi-curvature lens disclosed has a bottom hemispherical portion and a top aspherical portion. Light emitting diodes and photo detectors used in conjunction with bi-curvature lenses display symmetrical radiation intensity profiles, in accordance with Infrared Data Association standards and protocols.

Abstract: An electronic device having a first piece, a second piece moveable with respect to the first piece, and a position sensor operable to sense the position of the second piece relative to the first piece. The electronic device is operated in a first mode or a second mode dependent upon the position of the second piece relative to the first piece. Optionally, a proximity sensor is provided to detect the presence of a body in close proximity to the device when the second piece is in an open position relative to the first piece.

Abstract: Signal communication structures and methods for making the same are provided. One embodiment of the present invention comprises a signal communication structure. The structure comprises a signal communication element having a signal communication surface, an integrated circuit chip, and a substrate. A surface of the signal communication element other than the signal communication surface is physically coupled to a surface of the integrated circuit chip. In addition, another surface of the integrated circuit chip is communicatively coupled to the substrate. Furthermore, the size of the signal communication surface is greater than the size of the surface of the integrated circuit chip to which the signal communication element is physically coupled.