Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: An expandable capsule endoscope includes a shell, a membrane and a bag. Inside the shell are a first compartment and a second compartment, and the membrane is disposed between the first compartment and the second compartment. The bag is connected outside the shell. There is a first substance and a second substance respectively disposed in the first compartment and the second compartment. When the membrane is ruined and broken by a heating energy, the first substance and the second substance react to produce a gas filling the bag. The expandable capsule endoscope is applicable to examine an organ with wider diameters and advantageous to capture images of the organ thus providing better reliability and utility.