Patents by Inventor Sinji Sibata

Sinji Sibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding apparatus and method
    Patent number: 5452841
    Abstract: A wire bonding apparatus and method which enable fully automatic wire bonding between a connecting electrode on a circuit board and an external lead terminal while saving space to prevent enlargement of the package size.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: September 26, 1995
    Assignee: Nippondenso Co., Ltd.
    Inventors: Sinji Sibata, Shuji Sakou, Akihiko Ogino