Abstract: A fabrication method for applying electrically conductive circuit traces to a substrate is described. The method uses an ink composition which is applied to a selected substrate by an ink delivery system. The ink includes an adhesive in combination with other additives, including one or more sovlents. The ink is delivered by the ink jet system in a selected pattern, followed by the application of a powdered metal to the pattern which adheres to the adhesive in the ink. After the removal of excess powder, the substrate, pattern and powder are heated in an amount sufficient to melt the powder on the substrate. This produces a pattern of conductive traces geometrically corresponding to the ink pattern initially applied to the substrate.