Patents by Inventor Sirikhit Maniraj

Sirikhit Maniraj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120218674
    Abstract: An overcurrent protection system may be used to protect electrical circuit components from damage or failure due to abnormally high currents. The system may include a current interrupter electrically coupled between a power source and an electrical load. The current interrupter is configured to interrupt at least a portion of a current flow between the power source and the electrical load based on at least one current interrupt characteristic of the current interrupter. The system may also include an analog circuit component thermally coupled with the current interrupter. The analog circuit component is configured to generate heat in response to an overcurrent fault condition. At least a portion of the heat modifies the at least one current interrupt characteristic of the current interrupter.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 30, 2012
    Inventors: Neal H. Schultz, Sirikhit Maniraj, Matthew R. Williams
  • Patent number: 7148785
    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 12, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
  • Publication number: 20040218329
    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).
    Type: Application
    Filed: April 30, 2004
    Publication date: November 4, 2004
    Applicant: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski