Abstract: Connectors for processing packages are disclosed herein. An example male connector includes a plurality of wires. The example male connector further includes a socket pin. The example male connector further includes a paddle board connected to the socket pin. The example male connector further includes an overmolded cable housing the plurality of wires, the overmolded cable coupled to the paddle board, one of the plurality of wires coupled to the socket pin via the paddle board. The example male connector further includes a molded region to encompass the plurality of wires within a flat portion, the overmolded cable housing and the molded region to increase a height of the wires from the paddle board from a first height to a second height.

Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.

Abstract: Embodiments herein relate to a power monitor that can be used to dynamically change a power level of an electronic device and/or operational settings of a processor of the electronic device. Specifically, the power monitor may be configured to identify “droop” of power, and logic to update the power level and/or operational settings in accordance with identification of the droop. Other embodiments may be described and claimed.

Abstract: An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.

Abstract: Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.

Abstract: A universal bracket includes a first wall, a second wall, and a third wall. The first wall is configured to be fixed to a first circuit card and a second circuit card. The first circuit card and the second circuit card include any of at least two different standardized types of circuit cards. The second wall is opposite the first wall. The third wall extends between the first wall and the second wall and is configured to be fixed to a riser card having a first connector for receiving a first mating connector of the first circuit card and a second connector for receiving a second mating connector of the second circuit card.

Abstract: A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.

Abstract: A universal bracket includes a first wall, a second wall, and a third wall. The first wall is configured to be fixed to a first circuit card and a second circuit card. The first circuit card and the second circuit card include any of at least two different standardized types of circuit cards. The second wall is opposite the first wall. The third wall extends between the first wall and the second wall and is configured to be fixed to a riser card having a first connector for receiving a first mating connector of the first circuit card and a second connector for receiving a second mating connector of the second circuit card.