Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: A method for manufacturing a magnetic write head having a write pole with a very narrow track width, straight well defined sides and a well defined trailing edge width (e.g. track-width). The method includes uses two separate chemical mechanical polishing processes that stop at separate CMP stop layers. The first CMP stop layer is deposited directly over a RIEable fill layer. A RIE mask, is formed over the fill layer and first CMP stop layer, the RIE mask having an opening. A trench then is formed in the RIEable fill layer. A second CMP stop layer is then deposited into the trench and over the RIE mask, followed by plating of a magnetic material. First and second chemical mechanical polishing processes are then performed, the first stopping at the first CMP stop and the second stopping at the second CMP stop.

Abstract: A method for manufacturing a magnetic write head having a write pole with a very narrow track width, straight well defined sides and a well defined trailing edge width (e.g. track-width). The method includes uses two separate chemical mechanical polishing processes that stop at separate CMP stop layers. The first CMP stop layer is deposited directly over a RIEable fill layer. A RIE mask, is formed over the fill layer and first CMP stop layer, the RIE mask having an opening. A trench then is formed in the RIEable fill layer. A second CMP stop layer is then deposited into the trench and over the RIE mask, followed by plating of a magnetic material. First and second chemical mechanical polishing processes are then performed, the first stopping at the first CMP stop and the second stopping at the second CMP stop.

Abstract: A method for manufacturing a magnetic write head having a write pole with a tapered trailing edge step. The resulting tapered trailing edge step maximizes write field at very small bit sizes by preventing the magnetic saturation of the write pole at the pole tip. The method includes depositing a magnetic write pole material and then depositing a magnetic material over the magnetic write pole material. A RIE mask and hard mask are deposited over the magnetic bump material. A resist mask is formed over the RIE mask and hard mask, and a reactive ion etching is performed to transfer the pattern of the resist mask onto the underlying hard mask. Then an ion milling is performed to form a the magnetic step layer with a tapered edge that defines a tapered trailing edge step structure of the write pole.

Abstract: A method for manufacturing a magnetic write head having a write pole with a tapered, stepped trailing edge. The method includes depositing a magnetic write pole material over a substrate, and then forming a magnetic step structure over the magnetic write pole material. A mask structure is then formed, which includes a multilayer hard mask formed over the magnetic write pole material and the magnetic step structure. An ion milling process is then performed to remove a portion of the write pole material to define a write pole. A non-magnetic material can be deposited and ion milling performed to form non-magnetic side gap layer at the sides of the write pole. A multi-step reactive ion milling process can then be performed to remove the remaining hard mask from over the write pole.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method includes forming a write pole, and then depositing a refill layer. A mask structure can be formed over the writ pole and refill layer, the mask structure being configured to define a stitched pole. An ion milling or reactive ion milling can then be performed to remove portions of the refill layer that are not protected by the mask structure. Then a magnetic material can be deposited to form a stitched write pole that defines a secondary flare point. The stitched pole can also be self aligned with an electrical lapping guide in order to accurately locate the front edge of the secondary flare point relative to the air bearing surface of the write head.

Abstract: A method for manufacturing a magnetic write head that avoids the challenges associated with the formation of fence structures during write pole definition. A magnetic write pole material is deposited. A mask structure is deposited over the magnetic write pole material. The mask structure includes a first hard mask, a marker layer, a physically robust, inorganic RIEable image transfer layer, a second hard mask structure over the image transfer layer and a photoresist layer over the second hard mask. A reactive ion etching process can be used to transfer the image of the photoresist mask and second hard mask layer onto the image transfer layer. An ion milling is performed to define the write pole. A layer of non-magnetic material such as alumina is deposited. An ion milling is performed until the marker layer has been reached, and another reactive ion etching is performed to remove the remaining hard mask.

Abstract: A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method includes forming a write pole, and then depositing a refill layer. A mask structure can be formed over the writ pole and refill layer, the mask structure being configured to define a stitched pole. An ion milling or reactive ion milling can then be performed to remove portions of the refill layer that are not protected by the mask structure. Then a magnetic material can be deposited to form a stitched write pole that defines a secondary flare point. The stitched pole can also be self aligned with an electrical lapping guide in order to accurately locate the front edge of the secondary flare point relative to the air bearing surface of the write head.

Abstract: A system according to one embodiment includes a magnetic pole; a bump structure above the pole, the bump structure having a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the pole, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the pole, wherein the second angle is greater than the first angle; and a shield above the bump structure. A method according to one embodiment includes forming a bump layer above a magnetic pole; removing a portion of the bump layer for forming a step therein; and milling the bump layer for defining thereon a first surface oriented at a first angle between 1° and 89° from a plane of deposition of the bump layer, and a second surface oriented at a second angle between 1° and 89° from the plane of deposition of the bump layer, wherein the second angle is greater than the first angle.

Abstract: A method for manufacturing a write pole for a perpendicular magnetic write head. The method employs a damascene process to construct the write pole with a very accurately controlled track width. The method includes depositing a layer of material that can be readily removed by reactive ion etching. This material can be referred to as a RIEable material. A mask is formed over the RIEable material and a reactive ion etching is performed to form a tapered trench in the RIEAble material. A CMP stop layer can the be deposited, and a write pole plated into the trench. A CMP can then be performed to define the trailing edge of the write pole. Another masking, etching and plating step can be performed to form a trailing, wrap-around magnetic shield.

Abstract: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

Abstract: A method for manufacturing a write pole for perpendicular magnetic recording for accurately defining a side shield throat height and write pole flare point. The magnetic structure includes a write pole portion and first and second side shield portions. The side shields portions are magnetically connected with the write pole portion in a region in front of an intended air bearing surface plane (e.g. in the direction from which lapping will progress). The side shields portions are each separated from the write pole portion in a region behind the intended air bearing surface plane by notches that terminate at a desired location relative to the intended air bearing surface plane and which open up in a region behind the intended air bearing surface plane.

Abstract: A method for manufacturing a magnetic write head having a write pole with a flared step feature that defines a secondary flare point. The method involves depositing a magnetic write pole material on a substrate and then depositing a magnetic material over the write pole material followed by a non-magnetic material. A first mask is formed having a front edge to define the location of the secondary flare point, and one or more material removal processes are used to remove portions of the magnetic layer and non-magnetic layer that are not protected by this first mask. The first mask is replaced by a second mask that is configured to define a write pole, and an ion milling is performed to define the write pole. Shadowing from the magnetic layer and non-magnetic layer form a flared secondary flare point.

Abstract: A method for manufacturing a magnetic write head having a wrap around magnetic shield. The method allows a highly accurate short wavelength such as 193 mm photolithography to be used to accurately define the placement and critical dimension of wrap around magnetic shield. The method includes the formation of a magnetic write pole, top gap, and side gap and the deposition of a RIEable fill layer thereover, and CMP to planarization. A 193 nm photolithography and ion milling is used to form a mask over the RIEable layer and one or more reactive ion etching processes are performed to pattern the RIEable layer through 193 nm photolithography mask. A wrap around shield can then be electroplated into the opening formed in the RIEable layer.

Abstract: A multi-step process for notching the P1 pole of the write head element of a magnetic head. In a first step following the fabrication of the P2 pole tip, a layer of protective material is deposited on the approximately vertical side surfaces of the P2 pole tip. Thereafter, a first ion milling step, utilizing a species such as argon, is performed to mill through the write gap layer and to notch into the P1 pole layer therebelow. The removal of redeposited material from the side surfaces of the P2 pole tip is thereafter accomplished and the protective material formed on the side surfaces of the P2 pole tip protects the P2 pole tip during the redeposition clean up step. Thereafter, the protective material is removed from the side surfaces of the P2 pole tip, and a second ion milling step is performed to further notch the P1 pole material.

Abstract: A method for manufacturing a magnetic write head. The write head is constructed by a method that includes depositing a magnetic write pole material and then depositing a hard mask over the magnetic material. An inorganic image transfer layer is formed over the hard mask. SiC, alumina, SiO2, SiN, Ta or TaOx. This image transfer is physically robust, so that it does not bend or tip over during manufacture. The image of a patterned photoresist layer can be transferred onto the underlying image transfer layer, and an ion milling can be performed to pattern the image of the image transfer layer onto the underlying hard mask and magnetic material, thereby forming a magnetic write pole.

Abstract: In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

Abstract: A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.

Abstract: A method for forming a magnetic write head having a trailing shield with a tapered and stepped, self aligned trailing magnetic shield. The shield has a tapered portion that tapers away from the write pole as it extends away from the ABS. This tapered portion helps to channel flux to the pole tip portion of the shield, while preventing the loss of write field to the shield. The stepped portion of the shield further helps to prevent the loss of write field and also defines a secondary throat height of the shield that can be accurately located relative to the air bearing surface.

Abstract: A method for manufacturing a magnetic write head having a write pole with a tapered trailing edge step. The resulting tapered trailing edge step maximizes write field at very small bit sizes by preventing the magnetic saturation of the write pole at the pole tip. The method includes depositing a magnetic write pole material and then depositing a magnetic material over the magnetic write pole material. A RIE mask and hard mask are deposited over the magnetic bump material. A resist mask is formed over the RIE mask and hard mask, and a reactive ion etching is performed to transfer the pattern of the resist mask onto the underlying hard mask. Then an ion milling is performed to form a the magnetic step layer with a tapered edge that defines a tapered trailing edge step structure of the write pole.