Patents by Inventor So Dam AHN

So Dam AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protection film and electronic device including the same
    Patent number: 11974452
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5), where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Eun Oh, Jai Ku Shin, Han Sun Ryou, So Dam Ahn, Jang Doo Lee
  • PROTECTION FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20240040825
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5) where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 1, 2024
    Inventors: Young Eun OH, Jai Ku SHIN, Han Sun RYOU, So Dam AHN, Jang Doo LEE
  • Protection film having base layer over adhesive layer
    Patent number: 11812635
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5), where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: November 7, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Eun Oh, Jai Ku Shin, Han Sun Ryou, So Dam Ahn, Jang Doo Lee
  • PROTECTION FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20210320279
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5), where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Young Eun OH, Jai Ku SHIN, Han Sun RYOU, So Dam AHN, Jang Doo LEE
  • PROTECTION FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20200235340
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5), where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Inventors: Young Eun OH, Jai Ku SHIN, Han Sun RYOU, So Dam AHN, Jang Doo LEE
  • Protection film and electronic device including the same
    Patent number: 10665816
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5) where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Eun Oh, Jai Ku Shin, Han Sun Ryou, So Dam Ahn, Jang Doo Lee
  • PROTECTION FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20200091458
    Abstract: A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z?(5.1x+57.4)·ln(y)?(14.7x+140.5) where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
    Type: Application
    Filed: April 26, 2019
    Publication date: March 19, 2020
    Inventors: Young Eun OH, Jai Ku SHIN, Han Sun RYOU, So Dam AHN, Jang Doo LEE