Patents by Inventor So Eun JEONG

So Eun JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240145371
    Abstract: A power module and a method of manufacturing the same, includes at least one insulating substrate; and at least one semiconductor chip included on the at least one insulating substrate, the at least one insulating substrate including: an insulating layer; and a metal layer disposed between the at least one semiconductor chip and the insulating layer, forming electrical connection with the at least one semiconductor chip through a circuit pattern, and allowing a fluid filled in a sealed cavity formed in the metal layer to flow.
    Type: Application
    Filed: April 14, 2023
    Publication date: May 2, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: So Eun JEONG, Suk Hyun LIM
  • POWER MODULE
    Publication number: 20240136296
    Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
    Type: Application
    Filed: April 12, 2023
    Publication date: April 25, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG