Patents by Inventor So Hee KWON

So Hee KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141061
    Abstract: The present disclosure relates to an antibody binding specifically to CD55 or an antigen-binding fragment thereof; and a composition for preventing, treating and/or diagnosing cancer containing the same. The antibody of the present disclosure may be used as an effective therapeutic composition for various CD55-mediated diseases since it shows high binding ability and inhibitory effect for the CD55 protein which promotes tumor growth by inhibiting the complement immune mechanism. In addition, the antibody of the present disclosure may be usefully used as an effective therapeutic adjuvant that fundamentally removes drug resistance and remarkably improves therapeutic responsiveness in various diseases in which resistance to therapeutic agents with CDC (complement-dependent cytotoxicity) as a mechanism of action has been induced due to overexpression of CD55.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 2, 2024
    Applicants: SG MEDICAL INC, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Ji Chul LEE, Hye In PARK, Sung-Won MIN, Sung-Won MIN, Hyeong Sun KWON, Jae Cheong LIM, So Hee DOH, Eun Ha CHO, So-Young LEE, Sung Hee JUNG
  • Patent number: 11936968
    Abstract: A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion d
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: March 19, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hae Sik Kim, So Hee Choi, Jee Heum Paik, Na Kyung Kwon
  • Patent number: 9650325
    Abstract: Provided are a novel compound, preparing method thereof, and use thereof as inhibitor of histone demethylase. The compound represented by Chemical Formula 1 has activity which inhibits histone demethylase and thus is capable of specifically and effectively inhibit activity of histone demethylase.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: May 16, 2017
    Assignees: SNU R&DB FOUNDATION, INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Dong-Chan Oh, Seong-Hwan Kim, Jongheon Shin, Hak Cheol Kwon, So Hee Kwon
  • Publication number: 20150133564
    Abstract: Provided are a novel compound, preparing method thereof, and use thereof as inhibitor of histone demethylase. The compound represented by Chemical Formula 1 has activity which inhibits histone demethylase and thus is capable of specifically and effectively inhibit activity of histone demethylase.
    Type: Application
    Filed: April 2, 2014
    Publication date: May 14, 2015
    Applicants: SNU R&DB FOUNDATION, INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Dong-Chan OH, Seong-Hwan KIM, Jongheon SHIN, Hak Cheol KWON, So Hee KWON