Abstract: A vehicle controller determines whether the position of a detected travel lane relative to an edge of a road being traveled by a vehicle may differ from an actual position; estimates a first required time for an action, which is required before the vehicle reaches a predetermined location, for the case that the position of the detected lane relative to the edge of the road is correct; estimates a second required time for the action for the case that the position of the detected lane differs from the actual position by a predetermined number of lanes; and sets start timing of the action, based on the second required time, so that the action will finish before the vehicle reaches the predetermined location, when the position of the detected lane may differ from the actual position and the second required time is longer than the first required time.

Abstract: An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating.

Abstract: An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Abstract: An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating.

Abstract: An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Abstract: An ultraviolet curable resin composition includes (A) an ultraviolet curable resin, (B) an epoxy compound having at least two epoxy groups in one molecule, (C) a photopolymerization initiator and (D) a diluent. The ultraviolet curable resin (A) is obtained by the steps of polymerizing an ethylenically unsaturated monomer component containing (a) an ethylenically unsaturated monomer having epoxy group and (b) a compound having at least two ethylenically unsaturated groups in one molecule to prepare a copolymer, reacting the copolymer with (c) an ethylenically unsaturated monomer having carboxyl group to prepare a chemical intermediate, and reacting the chemical intermediate with (d) one of saturated and unsaturated polybasic acid anhydrides. This resin composition will be preferably used to prepare a photo solder resist ink developable with diluted alkaline aqueous solution.

Abstract: An ultraviolet-curable type photo solder resist ink comprises the following components (A) to (E). That is. the component (A) is an ultraviolet-curable resin having at least two ethylenically unsaturated groups and a carboxyl group per one molecule thereof. The component (B) is an epoxy compound having at least two epoxy groups per one molecule thereof. The component (C) is at least one selected from a compound having at least one carboxyl group and a polycarboxylic acid anhydride. The component (D) is a photopolymerization initiator. The component (E) is a diluent. This photo solder resist ink shows a good developing property even when a developer having a pH value of about 10 is used, and is excellent in a storage stability of resist, electrical corrosion resistance, electric performance, chemical resistance, plating resistance, heat resistance to solder, adhesion, and pencil hardness.

Abstract: An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.

Abstract: Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink.The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt % of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.

Abstract: Periphery detectors are arranged along the longitudinal direction of the log which is to be rotated one revolution around a temporary center, thereby a plurality of peripheries of cross sections along the longitudinal direction are detected for the log. The direction of the largest right circular cylinder is determined according to the largest inscribed circles for the peripheries of three cross sections (i.e., the ones adjacent to both the ends of the log and the one in the middle of the log) and the largest right circular cylinder itself is determined according to the peripheries of all cross sections detected. Thus the center line of said largest right circular cylinder is adopted as the turning center. The positions of a pair of inclined beams or swing arms are adjusted for canceling the deviation between the turning center and the temporary center.

Abstract: A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.

Abstract: Periphery detectors are arranged being juxtaposed closely, along the longitudinal direction of the log which is to be rotated one revolution around a virtual center, thereby a plurality of peripheries of cross sections along the longitudinal direction are detected for the log. The direction of the largest right circular cylinder is determined according to the largest inscribed circles for the peripheries of three cross sections (i.e., the ones adjacent to both the ends of the log and the one in the middle of the log) and the largest right circular cylinder itself is determined according to the peripheries of all cross sections detected. Thus the center line of said largest right circular cylinder is adopted as the turning center. The positions of a pair of inclined beams or swing arms are adjusted for canceling the deviation between the turning center and the virtual center.