Abstract: The invention can be used for improving performance of laser diodes, solar cells, microprocessors and other devices. The invention enables to create semiconductor devices and systems comprising several electronic components and having a great area of die, a great number of leads, high operating current and high heat dissipation. This is achieved by the following manner: offered leads are made of copper foil; the rigidity of the foil is decreased by means of creating of alternating narrow trenches and narrow through splits; the offered leads are microspring; additional improvement of performance can be achieved by the bending of inner leads along wide trenches. Offered leads can be directly connected to the dice.

Abstract: The invention can be used for improving performance of laser diodes, solar cells, microprocessors and other devices. The invention enables to create semiconductor devices having a great area of die, a great number of leads, a high operating current and a high heat dissipation. This is achieved by the following manner: offered leads are made of copper foil; the rigidity of the foil is decreased by means of disposing of alternating parallel narrow trenches on both sides of the foil; the offered leads are microspring; additional decreasing of rigidity can be achieved by the bending of foil along wide trenches that are created for this aim. Offered leads can be directly connected to the die.

Abstract: The present invention provides a solution, for topical application to a nail. The solution comprises between about 30% to about 85% DMSO by weight of the solution, a medicine, water and at least one of a moisturizing agent for assisting to retain moisture in the nail and prevent the nail from dehydrating, a dispersant for assisting to disperse the components in solution to provide a homogeneous solution when applied and when penetrating the nail, and a solubilizing agent for the medicine.

Abstract: The present invention determines and monitors the connection pattern of data ports which are connected by multiconductor cables without requiring special patch cables or patch panels. An adapter jacket having an external contact is placed over a standardized cable such as an RJ45 cable which connects the data ports. An adapter board having a plurality of socket contacts is placed adjacent a plurality of data ports. An output and input module are coupled to the socket contacts. A micro-processor which is coupled to the output and input module scans the socket contacts to determine the connection pattern of the data ports.