Patents by Inventor Son Kim Tran

Son Kim Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
    Patent number: 11810893
    Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: November 7, 2023
    Assignee: International Business Machines Corporation
    Inventors: William Emmett Bernier, Bing Dang, John Knickerbocker, Son Kim Tran, Mario J. Interrante
  • Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
    Publication number: 20210288022
    Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
    Type: Application
    Filed: May 31, 2021
    Publication date: September 16, 2021
    Inventors: William EMMETT BERNIER, BING DANG, JOHN KNICKERBOCKER, SON KIM TRAN, Mario J. Interrante
  • Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
    Patent number: 11049841
    Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: June 29, 2021
    Assignee: International Business Machines Corporation
    Inventors: William Emmett Bernier, Bing Dang, Mario J. Interrante, John Knickerbocker, Son Kim Tran
  • Chip carrier processing and shipping array and method of manufacture thereof
    Patent number: 6021904
    Abstract: A chip carrier which is employed in the industry for mounting integrated circuits and various types of electronic components on chips and is adapted to be positioned within a processing tray or carrier frame for shipping and processing purposes, and wherein the chip carrier is adapted to be precisely positioned and adhesively maintained in a fixed relationships in the carrier frame. Also disclosed is a method of manufacturing chip carrier arrays or strips which are adapted to be positioned in predetermined adhesively fixed relationships within a carrier frame or tray for processing and shipping purposes.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: February 8, 2000
    Assignee: International Business Machines Corporation
    Inventors: John E. Kozol, Duane A. Stanke, Son Kim Tran