Abstract: Disclosed is a method for synthesizing copper sulfide nano powder using plasma synthesis. The method comprises providing a copper compound to a plasma apparatus, adding a sulfur, and performing a plasma process with respect to the copper compound and the sulfur for synthesizing a nano copper sulfide.

Abstract: Disclosed is a method for synthesizing copper sulfide nano powder using plasma synthesis. The method comprises providing a copper compound to a plasma apparatus, adding a sulfur, and performing a plasma process with respect to the copper compound and the sulfur for synthesizing a nano copper sulfide.

Abstract: Disclosed herein is a flexible conductive substrate. According to the present invention, the flexible conductive substrate comprises a fabric substrate, a first film formed of metal or metal oxide on the fabric substrate, a second film formed of ITO film including tin oxide on the first film, and a third film formed of ITO film including tin oxide on the second film. A content of tin oxide included in the second film is smaller than that of oxide included in the third film.

Abstract: A flexible barrier fabric substrate includes a fabric base material, a planarization layer formed on the fabric base material, and a barrier layer formed on the planarization layer. One or more inorganic thin film layers and one or more polymer thin film layers are alternately stacked in the barrier layer.

Abstract: The present disclosure relates to a tool gripper chain bendable in two directions that has a chain assembly that includes: gripper blocks that each have a first tooth at the center of a curved groove; first and second gripper assemblies that have first and second gripper members rotatably mounted on the rear of gripper blocks and grip a tool; first and second outer links that are formed in an arc shape; first and second inner links that are formed in an arc shape and disposed zigzag with respect to first and second outer links between first outer link and second outer link; and first and second collars that are disposed between first inner link and second inner link, in which first gripper assembly is disposed in front of second outer link, second gripper assembly is disposed ahead of second inner ink, and a first shaft hole of first gripper assembly and second shaft hole of second gripper assembly are coaxially arranged, such that first and second gripper assemblies are coupled by a first shaft or a second s

Abstract: The present disclosure relates to a tool gripper chain bendable in two directions that has a chain assembly that includes: gripper blocks that each have a first tooth at the center of a curved groove; first and second gripper assemblies that have first and second gripper members rotatably mounted on the rear of gripper blocks and grip a tool; first and second outer links that are formed in an arc shape; first and second inner links that are formed in an arc shape and disposed zigzag with respect to first and second outer links between first outer link and second outer link; and first and second collars that are disposed between first inner link and second inner link, in which first gripper assembly is disposed in front of second outer link, second gripper assembly is disposed ahead of second inner ink, and a first shaft hole of first gripper assembly and second shaft hole of second gripper assembly are coaxially arranged, such that first and second gripper assemblies are coupled by a first shaft or a second s

Abstract: A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.