Patents by Inventor Soon Bum LEE

Soon Bum LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Piezoelectric device package and method of fabricating the same
    Patent number: 9929337
    Abstract: A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Bum Lee, Sang Yeob Cha, Jong Pil Lee, Katsushi Yasuda
  • DEVICE AND DEVICE PACKAGE
    Publication number: 20150351238
    Abstract: There are provided a device and a device package including a terminal electrically connected to a board and including one or more protrusion parts disposed on amounting surface on which the terminal is mounted on the board and the protrusion part is protruded from the mounting surface of the terminal.
    Type: Application
    Filed: December 9, 2014
    Publication date: December 3, 2015
    Inventors: Hyung Gon KIM, Katsushi YASUDA, Soon Bum LEE
  • PIEZOELECTRIC DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20140355646
    Abstract: A piezoelectric device package may include: a case having a plurality of terminals disposed on a lower surface thereof; a piezoelectric device disposed in the case; a temperature measuring device disposed on one surface of the piezoelectric device in the case and having a thin film form; and a cover member enclosing an upper portion of the case.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 4, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Pil LEE, Sang Yeob CHA, Soon Bum LEE, Jong Beom JEON, Katsushi YASUDA
  • PIEZOELECTRIC DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20140355647
    Abstract: A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 4, 2014
    Inventors: Soon Bum Lee, Sang Yeob Cha, Jong Pil Lee, Katsushi Yasuda