Patents by Inventor Soon-Jai Kim

Soon-Jai Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6361726
    Abstract: A method and apparatus for making an inner packaging container, in which fiber components of a pulp slurry, which is prepared by dissolving or dispersing pulp, carbon fibers, and sparsely acetificated PVA fibers in water together with sizing agents and additives, are deposited to a desired thickness over a mold surface of a lower mold perforated with a number of pores and defined with a suction chamber, under the condition in which the lower mold is immersed in the pulp slurry, using a reduction of pressure occurring in the suction chamber, and molded into a desired shape by the lower mold along with an upper mold engaging with the lower mold, thereby forming a conductive packaging container having an integral structure.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: March 26, 2002
    Inventor: Soon-Jai Kim