Patents by Inventor Soon Jin Oh

Soon Jin Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coil component and manufacturing method for the same
    Patent number: 11935682
    Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Jin Jeon, Seon Woo Oh, Soon Kwang Kwon
  • Size-controlled macromolecule
    Patent number: 9201067
    Abstract: The present application discloses a substrate that includes a molecular layer of regularly spaced size-controlled macromolecules comprising a polymer comprising branched and linear regions in which a plurality of termini on the branched region are bound to the substrate, and a terminus of the linear region is functionalized.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: December 1, 2015
    Assignees: POSCO, POSTECH FOUNDATION
    Inventors: Joon Won Park, Bong Jin Hong, Young Seo Choi, Soon Jin Oh, Kwan Yong Choi
  • One step diagnosis by dendron-mediated DNA chip
    Patent number: 9023597
    Abstract: This invention relates to chips containing nucleic acid probes or primers and their use in methods to detect nucleic acid molecules. The invention includes DNA chips in contact with a thermocycler capable of automatically regulating the temperature, temperature cycle times, and number of temperature cycles of the chips to provide genetic diagnosis in one step.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: May 5, 2015
    Assignee: Korea Materials & Analysis Corp.
    Inventors: Chi-Bom Chae, Soon Jin Oh