Patents by Inventor Soon Peng Jason Sim

Soon Peng Jason Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130277818
    Abstract: In one embodiment, a chip carrier support system includes a chip carrier support structure and a chip carrier. The chip carder forms a complementary fit with the chip carder support structure and includes an integrated circuit and a plurality of leads in communication with the integrated circuit.
    Type: Application
    Filed: January 20, 2011
    Publication date: October 24, 2013
    Inventors: Chi Hock Goh, Soon Peng Jason Sim, Poh Boon Teo
  • Patent number: 8355251
    Abstract: Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: January 15, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Soon Peng Jason Sim, Foo Luen Wong, Siew Mei Koon
  • Patent number: 8157593
    Abstract: An electronic communications equipment chassis has a panel with an aperture for receiving a connector module having at least one female jack. A plurality of elongate members of conductive material are attached to the panel, project into the aperture and form an EMI shield around the connector module.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 17, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Soon Peng Jason Sim, Cheng Nam Lee
  • Publication number: 20090229810
    Abstract: Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.
    Type: Application
    Filed: August 21, 2008
    Publication date: September 17, 2009
    Inventors: Soon Peng Jason Sim, Foo Luen Wong, Siew Mei Koon
  • Publication number: 20090023431
    Abstract: Systems and methods for communicating with a network device are provided. In this regard, a representative system, among others, includes a network switch associated with a telecommunications device; and a wireless interface device that wirelessly communicates with the network switch, the wireless interface device being configured to obtain information associated with the network switch and display at least a portion of the information obtained on a display device. A representative method, among others, for communicating with a network switch includes establishing a wireless link between the network switch and a wireless interface device; obtaining information associated with the network switch by the wireless interface device via the wireless link; and displaying at least a portion of the information obtained on a display device of the wireless interface device.
    Type: Application
    Filed: July 19, 2007
    Publication date: January 22, 2009
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Soon Peng Jason Sim, Chee Yung Tan, Kum Cheong Adam Chan, Koon Gee Ho, Chi Hock Goh, Chen Chin Jimmy Wong, Wee Yi Lee, Koh Yew Thoon, Lay Wei Ang