Patents by Inventor Soong Lin Teng

Soong Lin Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection for organic devices
    Patent number: 7026660
    Abstract: A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: April 11, 2006
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Ewald Guenther, Hooi Bin Lim, Shahrol Izzanni Abdul Manaf, Stefan Eigenbrodt, Soong Lin Teng
  • INTERCONNECTION FOR ORGANIC DEVICES
    Publication number: 20040211966
    Abstract: A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
    Type: Application
    Filed: April 25, 2003
    Publication date: October 28, 2004
    Inventors: Ewald Guenther, Hooi Bin Lim, Shahrol Izzanni Abdul Manaf, Stefan Eigenbrodt, Soong Lin Teng