Patents by Inventor Sophie ARCHAMBAULT

Sophie ARCHAMBAULT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Trench capacitor structure with hybrid filling layer
    Patent number: 11955568
    Abstract: A capacitor structure that includes a silicon substrate having a trench structure formed therein; a dielectric disposed over a surface of the trench structure, conformal to the surface of the trench structure; and a filling layer disposed over the dielectric layer and into the trench structure, the filling layer including a conductive layer and a polymer layer.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Larry Buffle, Frédéric Voiron, Sophie Archambault
  • TRENCH CAPACITOR STRUCTURE WITH HYBRID FILLING LAYER
    Publication number: 20220393038
    Abstract: A capacitor structure that includes a silicon substrate having a trench structure formed therein; a dielectric disposed over a surface of the trench structure, conformal to the surface of the trench structure; and a filling layer disposed over the dielectric layer and into the trench structure, the filling layer including a conductive layer and a polymer layer.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 8, 2022
    Inventors: Larry BUFFLE, Frédéric VOIRON, Sophie ARCHAMBAULT